The ChiP (converter housed in package) fabrication facility will produce power modules in the United States using process steps analogous to…
The ChiP (converter housed in package) fabrication facility will produce power modules in the United States using process steps analogous to…
The companies will look to combine Nexperia’s extensive background in gallium nitride (GaN) with Kyocera AVX’s…
The companies will look to combine Nexperia’s extensive background in gallium nitride (GaN) with Kyocera AVX’s expertise in advanced packaging…
With Delta’s power supply development know-how and ROHM’s vast experience in power semiconductors, the companies will…
With Delta’s power supply development know-how and ROHM’s vast experience in power semiconductors, the companies will look to develop 600 V…
Touting itself as the world's premier forum for power electronics, intelligent motion, renewable energy, and energy…
Touting itself as the world's premier forum for power electronics, intelligent motion, renewable energy, and energy management, the conference…
Measuring a scant 2.5 by 1.3 mm, the new diodes further miniaturization in automotive applications while maintaining high…
Measuring a scant 2.5 by 1.3 mm, the new diodes further miniaturization in automotive applications while maintaining high performance.
Introduced March 2 at the UK’s Future Propulsion Conference 2022 (FPC2022), the inverter delivers 350 kW peak and 250…
Introduced March 2 at the UK’s Future Propulsion Conference 2022 (FPC2022), the inverter delivers 350 kW peak and 250 kW continuous for powering…
The technology access agreement (TAA) allows II-VI to gain access to GE’s wide-ranging silicon carbide (SiC) module…
The technology access agreement (TAA) allows II-VI to gain access to GE’s wide-ranging silicon carbide (SiC) module technology and to its teams…
Innoscience Technology is hoping to make big waves in the Gallium Nitride (GaN) industry by fabricating 200mm (8")…
Innoscience Technology is hoping to make big waves in the Gallium Nitride (GaN) industry by fabricating 200mm (8") GaN-on-Si wafers and…
Japanese electronic components manufacturer ROHM is forming a new joint venture to head its SiC power module business.
Japanese electronic components manufacturer ROHM is forming a new joint venture to head its SiC power module business.
Solid Power, a leading developer company of all-solid-state batteries, recently unveiled a report containing its new…
Solid Power, a leading developer company of all-solid-state batteries, recently unveiled a report containing its new battery’s performance and…
NexWafe receives €39 million in funding to further develop its green solar wafer technology for large-scale production.
NexWafe receives €39 million in funding to further develop its green solar wafer technology for large-scale production.
GaN product supplier Transphorm landed a $1.4 million contract with DARPA to explore alternative radio frequency…
GaN product supplier Transphorm landed a $1.4 million contract with DARPA to explore alternative radio frequency solutions using Nitrogen-polar on…
NIST Researchers and collaborators developed a new technique to determine faulty semiconductor devices and that can also…
NIST Researchers and collaborators developed a new technique to determine faulty semiconductor devices and that can also count the number of…
Researchers from the University of Arkansas receive a $17.87 million grant from the National Science Foundation to build…
Researchers from the University of Arkansas receive a $17.87 million grant from the National Science Foundation to build and run a fabrication…
The new series includes 8 dual n-channel devices and 4 units featuring one p-channel and one n-channel MOSFET each.
The new series includes 8 dual n-channel devices and 4 units featuring one p-channel and one n-channel MOSFET each.
Chip giant Infineon is planning a significant boost to its investments in factory expansions over the next year.
Chip giant Infineon is planning a significant boost to its investments in factory expansions over the next year.
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