Advanced Semiconductor Engineering Inc. (ASE, Taiwan), an IC packaging company, announced its commitment to Ansoft Corp.'s (Pittsburgh, PA) HFSS™, Q3D Extractor™ and AnsoftLinks™ simulation products for IC packaging design and model extraction. ASE's standardization on Ansoft extends the existing investment and commitment to Ansoft solutions.
"We are very pleased to have a close partnership with ASE for IC package simulation and design," said Ansoft Taiwan Country Manager/Director of Business Development Charles Lee. "This relationship drives us to continue to develop our electromagnetic technology in order to meet leading-edge packaging design requirements vital to ASE and their end customers."
