TAEC Releases New TLP701 MOSFET/IGBT Gate Driver

Toshiba America Electronic Components Inc. (TAEC, Japan and Irvine, CA) announced a new high-speed, surface-mount, MOSFET/IGBT gate driver photocoupler designated the TLP701, which is housed in a new SDIP package that occupies half the space of the standard eight-pin DIP devices, and is the smallest opto-isolator package currently available that is designed to comply with reinforced insulation class international safety standards. The TLP701 photocoupler has been approved by UL and TUV(1), and similar approvals are expected from BSI and SEMKO.

Developed by Toshiba Corp. (Japan), the TLP701 photocoupler consists of a gallium aluminum arsenide, light-emitting diode and an integrated photodetector. The TLP701 is suitable for power MOSFET and IGBT gate drivers, which can be used in inverter circuits for home appliances and industrial motors where space considerations are important. Applications include plasma flat panel displays, air conditioners, uninterruptible power supplies, and other inverter-based equipment.

The TLP701 features an internal clearance of 7.0 mm (minimum), a creepage distance of 7.0 mm (minimum), and an isolation thickness of 0.4 mm (minimum). Power consumption is reduced with the new packaging, enabling the TLP701 to operate on 2 mA (maximum) supply current. The device may be operated at a wide range of temperatures, from -40 °C to +100 °C.

The supply current is low for the TLP701 at 2 mA (maximum) versus 11 mA (maximum) for the previous-generation driver TLP251. The operating temperature range is greater on the TLP701 at -40 °C to +100 °C versus -20 °C to +85 °C. Peak output current is greater also on the new TLP701 at 0.6 A (maximum) versus 0.4 A (maximum).

The Toshiba TLP701 is available now, priced at $0.90 each in sample quantities.