Samsung Electronics Co. Ltd. (Seoul, Korea) announced mass production of a four-chip, multi-chip package (MCP) for mobile handsets. The company also announced a new integrated software system that greatly reduces the development time of MCP, system-in-package (SiP) and system-on-chip (SoC) designs by enabling simultaneous design of semiconductor circuits and packages.
Samsung's MCP stacks four chips in the space of a single chip, reducing the footprint by 50 percent. The MCP is 1.4mm in height, which is 0.2mm greater than a conventional component of 1.2mm. The MCP resolves wiring and resistance problems that occur due to the lack of space and the increasing number of devices in mobile devices. Additionally, the MCP enhances the electrical characteristics of each component as well as the performance of the product.
Samsung's MCP can employ various memory products for mobile solutions: SDRAM, SRAM, UtRAM and NAND/NOR Flash memory. The new four-chip MCP is available in two combinations: a NOR flash-based combination, part number RRNU6412864, which consists of two 64Mbit NOR Flash memories, a 128Mbit NAND flash memory and a 64Mb UtRAM; and a NAND flash-based MCP, part number NUUS128643208, which consists of a 128Mbit NAND flash memory, a 64Mbit UtRAM, a 32Mbit UtRAM and an 8Mbit SRAM.
