Rogers Corporation´s Advanced Electronics Solutions Group Introduces curamik Endurace — Enhanced Direct Bonded Coppy Cermaic Substrate
Rogers Corporation’s (NYSE:ROG) Advanced Electronics Solutions (AES) group launches curamik Endurance substrates which is a Direct Bonded Copper Ceramic Substrate with enhanced properties.
curamik® Endurance substrates provide enhanced reliability performance compared to material combinations of the same dimensions. This reliability improvement makes the new substrates well suitable for high power applications, such as in EV/HEV, Vehicle Electrification, Industrial, Renewable and Mass Transit. curamik® Endurance extends the field of applications for DBC.
curamik Endurance Substrates:
- curamik Endurance (Al2O3)
- curamik Endurance Plus (HPS)
- curamik Endurance Thermal (AlN)
Thermal cycle tests show that curamik® Endurance substrates have an extraordinary increased lifetime compared to its alternative standard DBC substrates with dimples (AlN, Al2O3, HPS (ZTA)).
To achieve the increase in reliability, Rogers adjusted the design of the copper sidewall to gain the perfect stress release. The current available material combinations are all based on a 0.3mm copper thickness. The ceramic types Al2O3, HPS (ZTA) and AlN can be chosen by referencing our curamik® Ceramic Substrates - DBC Technology design rules.
- Cu-Thickness: 0.3 mm
- Ceramic Types: Al2O3, HPS, AlN
- Thermal conductivity: 24, 26, 170 W/mK
- Ceramic Thicknesses: acc. Std. Design Rules
Our solution is based on known material and combinations for easy implementation and therefore results in endurance by design.
Become a Member of the Design Support Hub
Rogers brings its more than 40 years of experience with Power Electronics Solutions together in a handy online resource that is available 24/7. The Design Support Hub features complete technical information on ROLINX busbars, capacitor busbar assemblies and curamik ceramic substrates, a library of technical papers on product design and problem solving and helpful videos on products and power distribution topics. Registration for access is quick and free of charge. The Design Support Hub provides information to help design engineers increase power, manage heat, and ensure the quality and reliability of their devices for optimal new product design (www.rogerscorp.com/designhub).
About Rogers Corporation
Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect and connect our world. Rogers delivers innovative solutions to help our customers solve their toughest material challenges. Rogers’ advanced electronic and elastomeric materials are used in applications for EV/HEV, automotive safety and radar systems, mobile devices, renewable energy, wireless infrastructure, energy-efficient motor drives, industrial equipment and more. Headquartered in Chandler, Arizona, Rogers operates manufacturing facilities in the United States, Asia and Europe, with sales offices worldwide. For more information, visit www.rogerscorp.com.