NXP Releases Large Range of Automotive Qualified Power SO-8 MOSFETs in LFPAK
NXP Semiconductors announced the launch of a full range of automotive power MOSFETs housed in the compact, thermally enhanced Loss Free PAcKage (LFPAK). According to NXP, the new range of Q101 qualified LFPAK MOSFETs combines its expertise in packaging technology and its experience in TrenchMOS technology to deliver what the company believes to be the most reliable Power SO-8 package in the world. LFPAK is optimized for high-density automotive applications with a footprint 46% smaller than that of DPAK whilst offering similar thermal performance.
According to NXP, with an ever-increasing consumer demand for more electronic applications, automotive OEMs face the challenge of introducing new features within the vehicle’s limited space, whilst trying to maintain fuel efficiency, electronic stability and reliability. LFPAK is NXP’s solution to the automotive requirement for a reliable, thermally enhanced power package with significantly reduced footprint size. The package design has been optimized to give the best thermal and electrical performance, cost and reliability to automotive OEMs. It overcomes the thermal limitations of SO8, enabling thermal resistance comparable to those of larger power packages such as DPAK.
The NXP LFPAK package uses a copper clip design to reduce the package resistance and inductance which in turn reduces the RDS(on) and switching losses of the MOSFET. LFPAK offers the designer a MOSFET with similar electrical and thermal performance to DPAK, with a footprint 46% smaller. According to NXP, this helps in designing a solution that is smaller than previously possible or to achieve up to 46% higher power density by adding new features to an existing design without increasing the module size or compromising on reliability. The full NXP range of LFPAKs allows designers to pick and choose devices according to application requirements, whilst enabling them to change their selection when module requirements change.
"We believe that NXP’s LFPAK will set a new industry benchmark as the most reliable power MOSFET package in the automotive market. It will allow the development of more compact modules for the automotive OEMs," said Norman Stapelberg, Senior Product Marketing Manager, NXP Semiconductors. "Customer feedback consistently shows that LFPAK is more reliable than competitor QFN & micro-lead devices. The launch of LFPAK displays NXPs continued commitment to the development and manufacture of low voltage MOSFETs for the automotive industry," he added.
Samples are currently available. Distribution samples for Europe, US and APAC will be available from July 2010.
