New Industry Products

High Power Density 3-Phase Inverter Module with IGBTs for AC Motor Drives

April 30, 2019 by Scott McMahan

Infineon Technologies AG added to its expanding family of intelligent power modules (IPMs), CIPOS™ Tiny. The 3-phase inverter module is the Infineon's newest generation of IPM, and it boasts the highest power density for variable speed motor drives. Using the company's latest TRENCHSTOP™ IGBT6 enables the inverter module to achieve maximum efficiency with minimum footprint.

The CIPOS Tiny IM393 series features a blocking voltage of 600V and four output current classes: Tiny S (6A) / Tiny M (10A) / Tiny L (15A) / Tiny X (20A).

Applications that benefit from CIPOS Tiny include high-efficiency washing machines, fans, compressors, and industrial drives.

The IPM will let customers reduce system cost, lower energy consumption, and improve reliability. Infineon will showcase CIPOS Tiny at PCIM 2019.

CIPOS Tiny is molded in a compact and fully-isolated and thermally enhanced 34mm x 15mm package.

In addition, the CIPOS Tiny is offered in both Tiny SIP and DIP form factors. It features an integrated, high-precision temperature monitor, over-current protection, and under-voltage lockout function. With these features, the IPM provides high, system-level protection and enables fail-safe operation. Utilizing the newest single 3-phase level-shifting high voltage driver IC boosts the efficiency and enhances the ruggedness.

The gate driver is compatible down to 3.3V controller outputs.


  • Newest low VCE(sat) Trench IGBT technology
  • Under-voltage lockout for all channels
  • Cross-conduction prevention logic
  • Integrated bootstrap functionality
  • Built-in NTC thermistor for temperature monitor
  • Offered in both DIP and SIP package with various lead length options
  • Rated max Tcase of 125°C


  • Enables system cost and size reduction for home appliance motor drives
  • Multiple lead length options available to ease mechanical design
  • SIP option allows PCB size reduction and alternative heatsink mounting
  • UL certified package and temp sensor
  • Improve system efficiency
  • Lower Tj for better reliability


All eight devices can be ordered now.

Infineon at the PCIM 2019

At the PCIM 2019 tradeshow, Infineon is presenting product-to-system solutions for applications that can shape the future. Infineon's is showing its demonstrations at booth #313 in hall 9 (Nuremberg, Germany, 7-9 May 2019).