Ericsson Launches PKM-C Family of DC Modules

Ericsson Power Modules (Sweden) announced the PKM-C family of dc/dc modules designed to respond to the new high-current demand in distributed power architectures. Complying with the de-facto, quarter-brick standard, the first module in the family, the PKM4118GC PINB, utilizes a new, enhanced footprint called "Double-P" to improve thermal behavior. Accordingly, the module contributes to better reliability of end-users’ host equipments.

The module is suitable for a broad range of applications where the output current required on-board is in the range 50A to 80A. Such applications include high-density telecom and datacom equipments, routers, optical transceivers, and multi-processors. The Double-P footprint incorporates two extra power pins so that in line with customers’ demands, the maximum current per pin is below 50A, with a preference for a maximum of 40A. The need for the new footprint was further fueled by the increased complexity of soldering processes of multi-player boards over 16 layers coupled with the thermal relief requirements of high-density dc/dc converters integrated with multi-processors.

The PKM-C Double-P design offers a number of benefits. The two extra power pins offer better distribution of current from the dc/dc module to the end-user board. Weak solder joints are less likely due to the afore-mentioned complexity of the process when assembling heavy copper, multi-layer boards and high-current dc/dc modules. The design improves the thermal coupling between the dc/dc converter and the motherboard, and overall efficiency is improved due to lower parasitic resistance due to interconnections.