eGaN Technology Takes a Quantum Leap in Both Performance and Cost
Efficient Power Conversion Corporation, the world’s leader in enhancement-mode gallium nitride on silicon (eGaN®) power FETs and ICs advances the performance
Efficient Power Conversion Corporation, the world’s leader in enhancement-mode gallium nitride on silicon (eGaN®) power FETs and ICs advances the performance capability while lowering the cost of off-the-shelf gallium nitride transistors with the introduction of the EPC2045 (7 mΩ, 100 V) and the EPC2047 (10 mΩ, 200 V) eGaN FETs. Applications for the EPC2045 include single stage 48 V to load Open Rack server architectures, point-of-load converters, USB-C, and LiDAR. Wireless charging, multi-level AC-DC power supplies, robotics, and solar micro inverters are example applications for the 200 V EPC2047.
Widening the performance/cost gap with equivalent silicon power transistors, the 100 V, 7 mΩ EPC2045, cuts the die size in half compared to the prior-generation EPC2001C eGaN FET. The 200 V, 10 mΩ EPC2047 eGaN FET also cuts the size in half so that it is now about 15 times smaller than equivalently rated silicon MOSFETs.
Heading 4Designers no longer have to choose between size and performance – they can have both! The chip-scale packaging of eGaN products handles thermal conditions far better than the plastic packaged MOSFETs since the heat is dissipated directly to the environment with chip-scale devices, whereas the heat from the MOSFET die is held within a plastic package.
There are three development boards available to support easy in-circuit performance evaluation of the EPC2045 and the EPC2047 respectively. The EPC9078 and EPC9080 support the 100 V EPC2045, whereas the EPC9081 features the 200 V EPC2047.
About EPC
EPC is the leader in enhancement mode gallium nitride based power management devices and was the first to introduce enhancementmode gallium-nitride-on-silicon (eGaN) FETs as power MOSFET replacements in applications such as DC-DC converters, wireless power transfer, envelope tracking, RF transmission, power inverters, remote sensing technology (LiDAR), and class-D audio amplifiers with device performance many times greater than the best silicon power MOSFET.
