New Industry Products

Chomerics Intros THERM-A-GAP T630/T630G Fillers

October 20, 2002 by Jeff Shepard

Chomerics (Woburn, MA), a division of Parker Hannifin Corp., introduced its THERM-A-GAP T630 and T630G form-in-place, fully cured, thermally conductive, gap filler materials that provide a highly conformable thermal path between hot components and heat spreaders. The thermal gap fillers are designed to replace gap-filling elastomeric pads that may over-stress component solder joints and leads, resulting in damage to

printed circuit boards.

Both the T630 and T630G materials are form-in-place, viscoelastic pastes that are conformable at low pressures. The materials achieve 50-percent deflection at only 1psi of pressure. The T630G material contains an added filler of 0.010in diameter glass beads that provide a compression stop in applications where electrical isolation is required. Both the T630 and T630G gap fillers provide thermal conductivity of 0.7W/mK and have low levels of extractable silicone and pass the Telcordia specification (GR78-CORE) for the telecommunications industry. Both materials are UL 94V-0 rated for flammability resistance.

THERM-A-GAP T630 and T630G thermally conductive materials are capable of filling gaps ranging in size from 0.010in to 0.300in. Typical applications include network and graphics boards, power supplies, and automotive electronics, such as telematics and entertainment devices. The material is suitable for re-work and field repair. No refrigeration is needed. Both of these one-part materials can be dispensed directly from syringes and tubes without premixing or curing. Standard material packaging is in 30cc and 300cc tubes.