Celsia Introduces Next Generation Heat Sink Technology For Replacing Heat Pipes In Computer, Telecommunications, & LED Lighting Applications

Celsia Technologies introduced its second generation NanoSpreader. Thermal transfer properties from the heat source to the vapor have been improved by 66% over the first generation, using a re-engineered internal structure that leverages the company’s patented combination of copper, liquid and vapor. These changes, developed through extensive collaboration with industry-leading computing and graphics manufacturers, are said to give the new NanoSpreader the ability to trump heat pipes as being the most cost-effective cooling solution.

"While maintaining reliability standards and manufacturing costs, our engineers have designed this next generation product to offer up to 30% better thermal performance than solutions using traditional heat pipes, and their design flexibility allows them to be used in some unexpected ways," said Joe Formichelli, Celsia’s CEO. "For instance, a single NanoSpreader can be made up to 70mm wide and attach directly to the heat source, eliminating the need for additional components while completely covering even a very large hot spot."

Nanospreaders are patented copper encased two-phase vapor chambers into which pure water is vacuum sealed. The liquid is absorbed by a copper wick and passed as vapor through a micro-perforated copper sheet where it cools and returns as liquid to the wick. Celsia claims that the latest generation technology is well suited for solving some of today’s biggest thermal challenges: cooling the latest microprocessors, reliably operating in harsh environments, and effectively dissipating heat in small spaces.

Whether it is a CPU used to power an entire computer or a special graphics processor (GPU) used by high end gamers or CAD designers, Celsia claims that the thermal requirements for cooling microprocessors are more demanding than ever before. The company’s new NanoSpreaders can cool power densities up to 150W/cm² while offering what is described as excellent multi-directional thermal spreading as low as 0.02°C per watt. Additionally, NanoSpreaders can withstand clamping forces up to 90 PSI, giving thermal designers the option of attaching them directly to the CPU/GPU.

Equipment that operates as part of the telecommunication backbone (such as repeaters and base stations) must be reliable in some of the harshest weather imaginable. With no moving parts, Celsia NanoSpreaders are designed and tested to withstand repeated exposure of -40 to +100°C.

While LED lighting technology is quickly offering an energy efficient alternative to other lighting technologies, it requires cooling solutions that are effective in small areas. The efficiency of Celsia’s NanoSpreaders combined into a remarkably thin package (from 1.5mm) is said to allow for lighting designs with higher lumens/watt.

The second-generation devices are available now, starting at under $2.00.