EEPower

Alliance Semiconductor Offers ASM3P2779 IC


New Products Dec 17, 2003 by Jeff Shepard

Alliance Semiconductor Corp. (Santa Clara, CA) announced the availability of its ASM3P2779 low-voltage, low-power, electromagnetic interference (EMI) reduction integrated circuit (IC) for next-generation portable devices. The ASM3P2779 is a low-power, versatile spread-spectrum frequency modulator designed for the mobile market and targets personal digital assistants, cell phones, portable MP3 players, notebooks, as well as video and imaging applications.

The ASM3P2779 is a general-purpose EMI reduction IC that is offered in a six-pin TSOT-23 (1.0mm maximum height). Operating at 2.5V or 3.3V and covering a frequency range of 15MHz to 30MHz, the ASM3P2779A draws less than 4mA at 30MHz with a 20pF load, and a mere 8µA in standby mode. The chip measures 3mm x 3mm x 1mm, offering a small and thin solution for the mobile market.

The ASM3P2779 is currently available, and pricing is at $1.50 per chip in volumes of 1,000. Custom frequency programming is available on a case-by-case basis.