Allegro Announces New Series of White Multi-Chip LEDs
Allegro® Microsystems Inc. announced a new series of white multi-chip LEDs that provide a range of high-powered InGaN white LEDs that can be used in general lighting applications, amusement and gaming equipment, and for backlighting TFT displays.
Each module combines either six or eight LEDs in one to four separate channels. The company claims that the modular design allows the SEPW devices to be easily assembled into string arrays by simply connecting the modules in a series. The devices are also said to provide superior color balance throughout the display because of the high density of LEDs that can be achieved. This minimizes the distance that power and control lines must run between LED modules and from the LED modules to the control electronics.
The white thermoplastic case is described as an innovative design with exceptional heat dissipation properties. The white resin compound is formulated for superior reflectance and transmittance of the generated light. It is claimed that enhanced thermal dissipation is achieved through the incorporated heatsink on the bottom of the package. The heatsink can be mated directly to an external radiator through the PCB for superior heat conduction allowing dense placement of modules.
The leadframe is plated with silver, providing a highly-reflective surface for the bottom and sides of the emitting area. The terminals and heatsink are also silver-plated.
