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TI Reports Revenue Decline Projects Further Decline

TI Reports Revenue Decline Projects Further Decline


News Oct 22, 2015 by Jeff Shepard
DiNardo Departs Exar Corp.

DiNardo Departs Exar Corp.


News Oct 22, 2015 by Jeff Shepard
Delta Americas Opens Net Zero Headquarters

Delta Americas Opens Net Zero Headquarters


News Oct 22, 2015 by Jeff Shepard
PMBus adds Intelligent Communications to Power Supplies

PMBus adds Intelligent Communications to Power Supplies

RS-232 Transceivers with Adjustable Low Voltage Interface

RS-232 Transceivers with Adjustable Low Voltage Interface

DSI-Ready STM32 Microcontrollers

DSI-Ready STM32 Microcontrollers

AC Surge Protectors meet UL 1449 Standard

AC Surge Protectors meet UL 1449 Standard

Thin-Film Precision Chips are Sulfur and Moisture Resistant

Thin-Film Precision Chips are Sulfur and Moisture Resistant

65W to 80W Adapters Comply with Level VI Efficiency

65W to 80W Adapters Comply with Level VI Efficiency

Powerbox adds Standard Industrial Power Offering

Powerbox adds Standard Industrial Power Offering


News Oct 21, 2015 by Jeff Shepard
Gresham Power Appointed Design-In Distributor by SL Power

Gresham Power Appointed Design-In Distributor by SL Power


News Oct 21, 2015 by Jeff Shepard
LG Chem expanding into Energy Storage Systems

LG Chem expanding into Energy Storage Systems


News Oct 21, 2015 by Jeff Shepard
Acquisition of Energent Solidifies Rodan’s DSM Offering

Acquisition of Energent Solidifies Rodan’s DSM Offering


News Oct 21, 2015 by Jeff Shepard
Wireless Audio and Battery Management for Hearing Aids

Wireless Audio and Battery Management for Hearing Aids

Renesas and port Announce CANopen Protocol Stack

Renesas and port Announce CANopen Protocol Stack

Grid-Resilient UL1741 125kW Power Conversion System

Grid-Resilient UL1741 125kW Power Conversion System

IEEE 1588 Solution for Smart Grid Communications

IEEE 1588 Solution for Smart Grid Communications

Single-Chip PLC Modem supports All Protocol Standards

Single-Chip PLC Modem supports All Protocol Standards

InFORMS vs the Trimmed  Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

InFORMS vs the Trimmed Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

This article discusses TT Electronics and Hybrid testing the inFORMS and discusses the reliability of this interconnect increases in thermal cycles.


Neah Power adds Hydrogen-on-Demand Platform

Neah Power adds Hydrogen-on-Demand Platform


News Oct 20, 2015 by Jeff Shepard