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12-V, 10-A DC-DC Step-Down Module is 2.3mm High

12-V, 10-A DC-DC Step-Down Module is 2.3mm High

Unidirectional ESD Protection in 01005 Flip Chip Package

Unidirectional ESD Protection in 01005 Flip Chip Package

5A / 600V Rectifier in DO-214AA Package

5A / 600V Rectifier in DO-214AA Package

48W Aux. Power Supply Evaluation Board for SiC FETs

48W Aux. Power Supply Evaluation Board for SiC FETs

Octal High-Side Switch and Driver Safely Demagnetizes Any Inductive Load for Industry 40

Octal High-Side Switch and Driver Safely Demagnetizes Any Inductive Load for Industry 40

This article introduces octal high-side switch and driver from Maxim Integrated Products


Strategic Collaboration to Accelerate Power Electronics Design

Strategic Collaboration to Accelerate Power Electronics Design

Semikron announced a technology collaboration with National Instruments (NI)to help lower the cost and risks of developing power conversion products


new products Feb 13, 2017 by SEMIKRON
Smallest 12V 10A DC-DC Step-down Power Solution

Smallest 12V 10A DC-DC Step-down Power Solution

Texas Instruments introduces a pair of 12-V, 10-A, 4-MHz step-down power modules that is 20 percent smaller than any other 10-A power module-based…


Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Littelfuse, Inc. introduces its new series of three unidirectional TVS diode arrays in space-saving 01005 flip-chip packages


new products Feb 13, 2017 by Littelfuse
Ridley Engineering Distinguished Lecture Series at Teledyne LeCroy Automotive Technology Center

Ridley Engineering Distinguished Lecture Series at Teledyne LeCroy Automotive Technology Center

Dr. Ray Ridley, president and founder of Ridley Engineering, will conduct a lecture series at Teledyne LeCroy Automotive Technology Center


IEDM 2016 Showcases the Latest Technology Developments in MicroNanoelectronics and Power Devices

IEDM 2016 Showcases the Latest Technology Developments in MicroNanoelectronics and Power Devices

The 62nd annual IEEE International Electron Devices Meeting, (IEDM) was held in San Francisco, California, USA December 3 - 7, 2016. For more than six


tech insights Feb 13, 2017 by Gary Dolny
GaN Transistor Gate Drive Optocouplers

GaN Transistor Gate Drive Optocouplers

This article features Broadcom's Gallium Nitride (GaN) Transistor Gate Drive Optocouplers and discusses its advantages, marketing, drive and…


Battery-Free UPS Wins Prestigious iF Design Award

Battery-Free UPS Wins Prestigious iF Design Award


News Feb 12, 2017 by Jeff Shepard
CETECOM is Exclusive Lab for Qi Test Tool Certifications

CETECOM is Exclusive Lab for Qi Test Tool Certifications


News Feb 12, 2017 by Jeff Shepard
NY-PEMC Fabs Initial 150mm SiC-Based Patterned Wafers

NY-PEMC Fabs Initial 150mm SiC-Based Patterned Wafers


News Feb 12, 2017 by Jeff Shepard
SiC Computer Chips for Longer Venus Surface Missions

SiC Computer Chips for Longer Venus Surface Missions


News Feb 12, 2017 by Jeff Shepard
zigbee PRO with Green Power Certified Platform

zigbee PRO with Green Power Certified Platform


News Feb 12, 2017 by Jeff Shepard
6kVA Programmable AC and DC Power Source

6kVA Programmable AC and DC Power Source

Dual Redundant, Hot Swappable Power for Video

Dual Redundant, Hot Swappable Power for Video

Inductors offer Footprint Options and Increased Energy Storage

Inductors offer Footprint Options and Increased Energy Storage

Tantalum-Cased, Hermetic Caps from 15 to 680 µF

Tantalum-Cased, Hermetic Caps from 15 to 680 µF