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Newest Generation of XSPairFET in DFN 33x33 Package Announced

Newest Generation of XSPairFET in DFN 33x33 Package Announced

Alpha and Omega Semiconductor Limited introduced AONE36132, a 25V N-Channel MOSFET in a dual DFN 3.3x3.3 package

new products Feb 06, 2018 by Alpha and Omega Semiconductor
ON Semiconductor Reports Short-Term Slowing in Q4 2017

ON Semiconductor Reports Short-Term Slowing in Q4 2017

News Feb 05, 2018 by Paul Shepard
Two-Wire, Zero Speed Differential Wheel Speed-Sensor IC

Two-Wire, Zero Speed Differential Wheel Speed-Sensor IC

new products Jan 30, 2018 by Paul Shepard
Unified Power Model for System-Level IC Design being Developed

Unified Power Model for System-Level IC Design being Developed

News Jan 24, 2018 by Paul Shepard
New Accu-L Series Thin Film Chip Inductors for Automotive Signal and Power Applications Released

New Accu-L Series Thin Film Chip Inductors for Automotive Signal and Power Applications Released

AVX Corporation has released a new series of thin-film multilayer chip inductors especially designed to meet demanding performance specifications…

new products Jan 23, 2018 by AVX
Thin-Film Chip Inductors for Automotive Signal & Power

Thin-Film Chip Inductors for Automotive Signal & Power

new products Jan 22, 2018 by Paul Shepard
Ultra-Low Power Consumption Voltage Detection IC with MOSFET

Ultra-Low Power Consumption Voltage Detection IC with MOSFET

new products Jan 21, 2018 by Paul Shepard
Flip-Chip Packaging Solution for Premium LED Lighting

Flip-Chip Packaging Solution for Premium LED Lighting

News Jan 18, 2018 by Paul Shepard
Peregrine Semiconductor Is Now pSemi

Peregrine Semiconductor Is Now pSemi

News Jan 17, 2018 by Paul Shepard
Ultra-Low-Power Battery Protection IC for Wearables and Small IoT Devices

Ultra-Low-Power Battery Protection IC for Wearables and Small IoT Devices

new products Jan 16, 2018 by Paul Shepard
Artificial Intelligence Chip Delivers 15 Teraflops using under 5 Watts

Artificial Intelligence Chip Delivers 15 Teraflops using under 5 Watts

News Jan 11, 2018 by Paul Shepard
Next Generation Silicon Carbide Power Device with 3DSiC Technology

Next Generation Silicon Carbide Power Device with 3DSiC Technology

Ascatron provides next generation Silicon Carbide (SiC) power semiconductors using its proprietary 3DSiC® technology with a quality and…

new products Jan 11, 2018 by Ascatron
Dynex Launches High-Voltage Semiconductor Foundry Business

Dynex Launches High-Voltage Semiconductor Foundry Business

News Jan 10, 2018 by Paul Shepard
NPC Modules with Latest IGBT Chip Tech for up to 120kVA

NPC Modules with Latest IGBT Chip Tech for up to 120kVA

new products Jan 10, 2018 by Paul Shepard
High-Voltage Multi-Channel Solenoid and Unipolar Motor Driver IC

High-Voltage Multi-Channel Solenoid and Unipolar Motor Driver IC

Toshiba Electronics Europe (TEE) announced the launch of a multi-channel solenoid and unipolar motor driver IC (TB67S111PG) that delivers…

new products Jan 10, 2018 by Toshiba Europe
IC Process with Ultra-High Breakdown Voltage for Digital Isolators

IC Process with Ultra-High Breakdown Voltage for Digital Isolators

News Jan 08, 2018 by Paul Shepard
Energous & Dialog Unveil Wireless Charging 2.0 IC

Energous & Dialog Unveil Wireless Charging 2.0 IC

new products Jan 07, 2018 by Paul Shepard
Suntech Achieves Volume Production of Black Silicon Solar Cells

Suntech Achieves Volume Production of Black Silicon Solar Cells

News Jan 04, 2018 by Paul Shepard
Three-Phase MOSFET Driver IC with On-Board Regulator

Three-Phase MOSFET Driver IC with On-Board Regulator

new products Jan 01, 2018 by Paul Shepard
Single-Chip Balun for sub-1GHz Radio Reduces Board Space by 96%

Single-Chip Balun for sub-1GHz Radio Reduces Board Space by 96%

new products Dec 18, 2017 by Paul Shepard