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Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging

Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging


News Oct 10, 2019 by Paul Shepard
Power Integrations Delivers OneMillionth GaNBased InnoSwitch3 IC

Power Integrations Delivers OneMillionth GaNBased InnoSwitch3 IC

Partners with Anker Innovations to drive GaN revolution in mass-market AC-DC power adapters SAN JOSE, Calif.-- Power Integrations, the leader in…


Bosch Enters Automotive Silicon Carbide Race

Bosch Enters Automotive Silicon Carbide Race


News Oct 08, 2019 by Paul Shepard
Bluetooth 5.0-Qualified Dual-Mode Audio IC and Fully-Certified Module

Bluetooth 5.0-Qualified Dual-Mode Audio IC and Fully-Certified Module

AI Chip Design Platform to Boost Semiconductor Design Productivity and Quality

AI Chip Design Platform to Boost Semiconductor Design Productivity and Quality


News Oct 07, 2019 by Paul Shepard
Torex Semiconductor Forms an Alliance with India-based Cirel Systems

Torex Semiconductor Forms an Alliance with India-based Cirel Systems


News Oct 03, 2019 by Paul Shepard
CCM/DCM Flyback Ideal Diode with Integrated 100V/10mΩ FET and No Need for Auxiliary Winding

CCM/DCM Flyback Ideal Diode with Integrated 100V/10mΩ FET and No Need for Auxiliary Winding

X-FAB Strengthens Foundry Service Cooperation with EUROPRACTICE

X-FAB Strengthens Foundry Service Cooperation with EUROPRACTICE

X-FAB Silicon Foundries SE announced that it is broadening the scope of its cooperation with the EUROPRACTICE Consortium which counts high-profile…


new products Oct 02, 2019 by X-Fab
Dutch Solar Car Team Chooses UnitedSiC Silicon Carbide FET Devices for Global Racing Challenge

Dutch Solar Car Team Chooses UnitedSiC Silicon Carbide FET Devices for Global Racing Challenge

Dutch Solar Car Team Chooses UnitedSiC Silicon Carbide FET Devices for Global Racing Challenge.


600V Sine-Wave PWM Driver IC for Three-Phase Brushless Motors

600V Sine-Wave PWM Driver IC for Three-Phase Brushless Motors

Integrated Silicon III-V Chips to be Commercially Available in 2020

Integrated Silicon III-V Chips to be Commercially Available in 2020


News Sep 30, 2019 by Paul Shepard
Capacitors Optimized for Fast Switching Wide Bandgap Semiconductor Designs

Capacitors Optimized for Fast Switching Wide Bandgap Semiconductor Designs

Power Integrations Delivers One-Millionth GaN-Based InnoSwitch3 IC

Power Integrations Delivers One-Millionth GaN-Based InnoSwitch3 IC


News Sep 30, 2019 by Paul Shepard
Toshiba Launches High-Voltage Dual-Channel Solenoid Driver IC

Toshiba Launches High-Voltage Dual-Channel Solenoid Driver IC

Toshiba Launches High Voltage Dual Channel Solenoid Driver IC

Toshiba Launches High Voltage Dual Channel Solenoid Driver IC

This article highlights Toshiba Electronics Europe GmbH dual-channel solenoid driver IC that provides a high-voltage drive with low ON resistance.


Elmos to sell Silicon Microstructures Inc. to TE Connectivity for $95 Million

Elmos to sell Silicon Microstructures Inc. to TE Connectivity for $95 Million


News Sep 24, 2019 by Paul Shepard
SOI Industry Consortium Announces Awards During Shanghai Event

SOI Industry Consortium Announces Awards During Shanghai Event

The SOI Industry Consortium announced awards to two luminaries of the semiconductor industry.


Researchers Pursuing Advanced Control Techniques for Semiconductor Process Power Applications

Researchers Pursuing Advanced Control Techniques for Semiconductor Process Power Applications


News Sep 22, 2019 by Paul Shepard
Porous Silicon Layers for More Efficient Lithium-Ion Batteries

Porous Silicon Layers for More Efficient Lithium-Ion Batteries


News Sep 18, 2019 by Paul Shepard
Low-Cost Version of 600V Half-Bridge Driver IC

Low-Cost Version of 600V Half-Bridge Driver IC