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TI enters Strategic Relationship with Silicon Catalyst

TI enters Strategic Relationship with Silicon Catalyst


News Aug 24, 2016 by Jeff Shepard
Silicon may Replace Graphite in Li-ions

Silicon may Replace Graphite in Li-ions


News Aug 24, 2016 by Jeff Shepard
Buck/Boost Controller with Integrated Buck FET

Buck/Boost Controller with Integrated Buck FET

LDOs in Breakthrough Bumpless Chip-Scale Package

LDOs in Breakthrough Bumpless Chip-Scale Package

1500V Super-Junction FET in TO-220FP Wide-Creepage Package

1500V Super-Junction FET in TO-220FP Wide-Creepage Package

Mouser Signs Global Agreement with Torex Semiconductor

Mouser Signs Global Agreement with Torex Semiconductor


News Aug 01, 2016 by Jeff Shepard
Anti-Surge Thick Film Chip Resistors

Anti-Surge Thick Film Chip Resistors

Illumination LED Driver IC with Single-Wire Input

Illumination LED Driver IC with Single-Wire Input

Compact H-Bridge Driver IC for Low-Voltage 25V Drives

Compact H-Bridge Driver IC for Low-Voltage 25V Drives

Toshiba Electronics Europe has announced an addition to its range of H-bridge [1] driver ICs for brushed DC and stepper motors


Silicon Solar Cell Efficiencies Continue to Climb

Silicon Solar Cell Efficiencies Continue to Climb


News Jul 13, 2016 by Jeff Shepard
Fast GaN FET Driver Unveiled Utilizing UltraCMOS Technology

Fast GaN FET Driver Unveiled Utilizing UltraCMOS Technology

Peregrine Semiconductor Corp. introduces the word’s fastest GaN FET driver, the UltraCMOS® PE29100


Open-Source RISC-V Chip Platforms

Open-Source RISC-V Chip Platforms


News Jul 11, 2016 by Jeff Shepard
80V Half-Bridge 33MHz GaN FET Driver

80V Half-Bridge 33MHz GaN FET Driver

30V / 1.5A Photorelays for Semiconductor Testers

30V / 1.5A Photorelays for Semiconductor Testers

SiC IC Design Process Model Grant from NASA

SiC IC Design Process Model Grant from NASA


News Jul 10, 2016 by Jeff Shepard
Consortium to address Wafer-Level Packaging Challenges

Consortium to address Wafer-Level Packaging Challenges


News Jun 29, 2016 by Jeff Shepard
ABB opens Silicon Valley Campus with IoTSP Focus

ABB opens Silicon Valley Campus with IoTSP Focus


News Jun 29, 2016 by Jeff Shepard
Bluetooth Low Energy Single-Chip Solution

Bluetooth Low Energy Single-Chip Solution

Battery-Charger IC Reduces Cost and Time-to-Market

Battery-Charger IC Reduces Cost and Time-to-Market

Three-Wire True Zero-Speed Magnetic Speed-Sensor IC

Three-Wire True Zero-Speed Magnetic Speed-Sensor IC