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Navitas GaN Power IC Enables Credit-Card-Size 100W Charger

Navitas GaN Power IC Enables Credit-Card-Size 100W Charger

new products Nov 11, 2019 by Paul Shepard
GTAT ISO-9001:2015 Certification for Silicon Carbide

GTAT ISO-9001:2015 Certification for Silicon Carbide

News Nov 11, 2019 by Paul Shepard
Current Sensors Measure up to 2kA AC or DC for SiC or GaN Inverter Designs

Current Sensors Measure up to 2kA AC or DC for SiC or GaN Inverter Designs

new products Nov 09, 2019 by Paul Shepard
TAIYO YUDEN Launched Automotive Chip Bead Inductor with an Operating Temperature of 150ºC

TAIYO YUDEN Launched Automotive Chip Bead Inductor with an Operating Temperature of 150ºC

TAIYO YUDEN Launched Automotive Chip Bead Inductor with an Operating Temperature of 150°C.

new products Nov 08, 2019 by Taiyo Yuden
125°C Chip-Type Conductive Polymer Aluminum Solid Electrolytic Capacitors

125°C Chip-Type Conductive Polymer Aluminum Solid Electrolytic Capacitors

new products Nov 07, 2019 by Paul Shepard
Taiwan Semiconductor Introduces 45V and 60V Trench Schottky Rectifiers in SMPc46U Package

Taiwan Semiconductor Introduces 45V and 60V Trench Schottky Rectifiers in SMPc46U Package

Taiwan Semiconductor Introduces 45V and 60V Trench Schottky Rectifiers in SMPc4.6U Package for Automotive Market.

new products Nov 06, 2019 by Taiwan Semiconductor
Alpha and Omega Semiconductor Introduces 18V 2A and 3A EZBuck in Thermally Enhanced Ultra-thin TSOT23-6 Package

Alpha and Omega Semiconductor Introduces 18V 2A and 3A EZBuck in Thermally Enhanced Ultra-thin TSOT23-6 Package

This article highlights AOS AOZ6682CI and AOZ6683CI high efficiency, simple-to-use synchronous buck regulators for consumer electronics applications.

new products Nov 06, 2019 by Alpha and Omega Semiconductor
Complete USB Type-C Port-Protection IC Simplifies Connectivity Upgrades

Complete USB Type-C Port-Protection IC Simplifies Connectivity Upgrades

new products Nov 05, 2019 by Paul Shepard
ZF and Cree Partner to Advance SiC-Based Electric Vehicle Inverters

ZF and Cree Partner to Advance SiC-Based Electric Vehicle Inverters

News Nov 05, 2019 by Paul Shepard
Half-Bridge Evaluation Board from GaN Systems and ON Semiconductor Demonstrates Next Performance Leap in GaN

Half-Bridge Evaluation Board from GaN Systems and ON Semiconductor Demonstrates Next Performance Leap in GaN

Half-Bridge Evaluation Board from GaN Systems and ON Semiconductor Demonstrates Next Performance Leap in GaN.

new products Nov 04, 2019 by GaN Systems
Baseus uses GaNFast from Navitas Semiconductor in 3-Output 65W Charger

Baseus uses GaNFast from Navitas Semiconductor in 3-Output 65W Charger

new products Oct 30, 2019 by Paul Shepard
Optima Design Launches Next-Generation Semiconductor Functional Safety Tools

Optima Design Launches Next-Generation Semiconductor Functional Safety Tools

News Oct 30, 2019 by Paul Shepard
Dialog Semiconductor Launches Configurable HighFrequency SubPMICs Powering Latest Mobile Processors

Dialog Semiconductor Launches Configurable HighFrequency SubPMICs Powering Latest Mobile Processors

Dialog Semiconductor Launches Configurable, High-Frequency Sub-PMICs Powering Latest Mobile Processors.

new products Oct 29, 2019 by Dialog Semiconductor
Search for the Next Ltd and Semefab Introduce a New Transistor Wafer Process Technology

Search for the Next Ltd and Semefab Introduce a New Transistor Wafer Process Technology

Search For The Next’s technology uses quantum tunnel mechanics enabling complex ICs to be made competitively in existing…

new products Oct 25, 2019 by Search for the Next
Cree & NY CREATES Announce First SiC Wafer Demonstration at SUNY Poly

Cree & NY CREATES Announce First SiC Wafer Demonstration at SUNY Poly

News Oct 23, 2019 by Paul Shepard
High-Capacitance 63V and 80V Chip-Type Aluminum Electrolytic Capacitors

High-Capacitance 63V and 80V Chip-Type Aluminum Electrolytic Capacitors

new products Oct 23, 2019 by Paul Shepard
Two-Phase, Direct-on-Chip, Liquid Cooling for Data Centers

Two-Phase, Direct-on-Chip, Liquid Cooling for Data Centers

News Oct 23, 2019 by Paul Shepard
Odyssey Semi Completes Strategic Acquisition of High-Voltage GaN Wafer Fab

Odyssey Semi Completes Strategic Acquisition of High-Voltage GaN Wafer Fab

News Oct 23, 2019 by Paul Shepard
Fraunhofer’s Modul Project Aims to Embed SiC Power Devices into Substrates

Fraunhofer’s Modul Project Aims to Embed SiC Power Devices into Substrates

News Oct 19, 2019 by Paul Shepard
Single-Chip ASIL-D-Compliant Battery Management IC for Mid-to-Large Cell Counts

Single-Chip ASIL-D-Compliant Battery Management IC for Mid-to-Large Cell Counts

new products Oct 17, 2019 by Paul Shepard