X-FAB expands its SiC capacity and adds new in-house epitaxy capabilities
X-FAB expands its SiC capacity and adds new in-house epitaxy capabilities
By pairing the SCALE-iDriver control and safety features with its high-speed FluxLink™ communication technology, Power…
By pairing the SCALE-iDriver control and safety features with its high-speed FluxLink™ communication technology, Power Integrations delivers a…
Richardson RFPD announced the availability and full design support capabilities for a new silicon carbide module from…
Richardson RFPD announced the availability and full design support capabilities for a new silicon carbide module from Wolfspeed, a Cree Company.
Efficient Power Conversion (EPC) introduces the first of a new integrated circuit (IC) product family offering higher…
Efficient Power Conversion (EPC) introduces the first of a new integrated circuit (IC) product family offering higher performance and smaller…
Microchip introduces SiC SBD Modules that utilizes Microchip's newest generation of SiC die.
Microchip introduces SiC SBD Modules that utilizes Microchip's newest generation of SiC die.
This article discusses Pre-Switch's solution for the elimination of switching losses by incorporating AI into the…
This article discusses Pre-Switch's solution for the elimination of switching losses by incorporating AI into the Auxiliary Resonant…
The Connected Lighting Platform for LED control features multiple forms of connectivity, including Bluetooth Low Energy,…
The Connected Lighting Platform for LED control features multiple forms of connectivity, including Bluetooth Low Energy, provided by the RSL10 SIP,…
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