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Next-Generation System for Power Devices Transitioning to Large Wafer Formats

Next-Generation System for Power Devices Transitioning to Large Wafer Formats


News Sep 03, 2013 by Jeff Shepard
Improved Tandem Diodes from STMicro Offered as Economical Alternative to SiC

Improved Tandem Diodes from STMicro Offered as Economical Alternative to SiC

IXYS Intros High-Power SiC Diode Modules for 600V and 1200V Applications

IXYS Intros High-Power SiC Diode Modules for 600V and 1200V Applications

2-Channel Brushed DC Motor Driver IC Supports High Voltages and Currents

2-Channel Brushed DC Motor Driver IC Supports High Voltages and Currents

Brushless Motor Pre-Driver IC for Start-Stop  Automotive Applications

Brushless Motor Pre-Driver IC for Start-Stop Automotive Applications

Solid Tantalum Chip Capacitors for Non-Life-Support Medical Devices

Solid Tantalum Chip Capacitors for Non-Life-Support Medical Devices

Control IC Offered as Cost-Effective Magnetic Replacement Ballast Solution

Control IC Offered as Cost-Effective Magnetic Replacement Ballast Solution

Best Player in Chess History is an Ambassador for Nordic Semiconductor

Best Player in Chess History is an Ambassador for Nordic Semiconductor


News Aug 12, 2013 by Jeff Shepard
ams Introduces LIN Slave Companion IC to Support Automotive ISO26262 Safety

ams Introduces LIN Slave Companion IC to Support Automotive ISO26262 Safety

3 Days of GaN, SiC and GaAs Power Semis at DPF ‘13

3 Days of GaN, SiC and GaAs Power Semis at DPF ‘13


News Aug 11, 2013 by Jeff Shepard
Expanded Resistance Range for 2W Metal-Plate Chip Current-Sense Resistors

Expanded Resistance Range for 2W Metal-Plate Chip Current-Sense Resistors

600V BLDC MOSFET Gate Drive IC for Hybrid, Electric Vehicle and 48V Applications

600V BLDC MOSFET Gate Drive IC for Hybrid, Electric Vehicle and 48V Applications

TI’s Single-Chip DockPort Solution for DisplayPort, USB and Power over Single Cable

TI’s Single-Chip DockPort Solution for DisplayPort, USB and Power over Single Cable

Toshiba Launches Three-Phase Brushless Motor Driver IC for Appliances

Toshiba Launches Three-Phase Brushless Motor Driver IC for Appliances

VPG Releases New Flip-Chip 0805 Resistor Based on Z1 Foil Technology

VPG Releases New Flip-Chip 0805 Resistor Based on Z1 Foil Technology

Delta Elektronika uses Cree SiC FETs in Next-Gen High-Efficiency Power Supplies

Delta Elektronika uses Cree SiC FETs in Next-Gen High-Efficiency Power Supplies


News Jul 21, 2013 by Jeff Shepard
Smallest PFC Boost IC in a 5-pin SOT-23 Package Claimed by IR

Smallest PFC Boost IC in a 5-pin SOT-23 Package Claimed by IR

ON Semiconductor Awarded ISO 13485 Certification for its Advanced Packaging Facility

ON Semiconductor Awarded ISO 13485 Certification for its Advanced Packaging Facility


News Jul 16, 2013 by Jeff Shepard
High-Output Power Digital Audio System-on-Chip Delivers 2 X 20W

High-Output Power Digital Audio System-on-Chip Delivers 2 X 20W

Taiyo Yuden Expands Lineup of Multilayer Chip Bead Inductors for Smartphones

Taiyo Yuden Expands Lineup of Multilayer Chip Bead Inductors for Smartphones