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Toshiba Launches Qi Compliant Wireless Power Receiver IC with Low Heat Generation

Toshiba Launches Qi Compliant Wireless Power Receiver IC with Low Heat Generation

Trinamic Claims World’s Lowest Cost Single-Axis Motion Controller IC

Trinamic Claims World’s Lowest Cost Single-Axis Motion Controller IC

Split-Output Topology Improves Dynamic Behavior in SiC MOSFET Modules

Split-Output Topology Improves Dynamic Behavior in SiC MOSFET Modules

10A Gate Drive IC Shrinks Automotive High-Current Switching Systems

10A Gate Drive IC Shrinks Automotive High-Current Switching Systems

VPG Extends Z-Foil Ultra-High-Precision Flip Chip COTS Resistors Down to 5 Ω

VPG Extends Z-Foil Ultra-High-Precision Flip Chip COTS Resistors Down to 5 Ω

Toshiba Launches Load Switch IC claiming Industry’s Lowest ON Resistance

Toshiba Launches Load Switch IC claiming Industry’s Lowest ON Resistance

Altera Demonstrates Integrated PLC and HMI System on a Single Chip

Altera Demonstrates Integrated PLC and HMI System on a Single Chip

RAVS Series Anti-Sulfur Chip Resistor Arrays

RAVS Series Anti-Sulfur Chip Resistor Arrays

BLDC IC Enables Accurate Pump Control in Cars fitted with Idling-Reduction Systems

BLDC IC Enables Accurate Pump Control in Cars fitted with Idling-Reduction Systems

SiC Schottky Diodes in SMB (DO-214) packages offer smallest footprints

SiC Schottky Diodes in SMB (DO-214) packages offer smallest footprints

Power Integrations Completes Rollout of LYTSwitch-4 LED-Driver IC Family

Power Integrations Completes Rollout of LYTSwitch-4 LED-Driver IC Family

Single-Chip Solution Extends Smart Phone and Tablet Battery Life

Single-Chip Solution Extends Smart Phone and Tablet Battery Life

Cadence Launches Voltus IC Power Integrity Solution

Cadence Launches Voltus IC Power Integrity Solution


News Nov 11, 2013 by Jeff Shepard
High-Frequency Two-Switch-Forward IC Cuts System Cost and Footprint

High-Frequency Two-Switch-Forward IC Cuts System Cost and Footprint

Silicon Carbide Bare Die up to 8000V from GeneSiC

Silicon Carbide Bare Die up to 8000V from GeneSiC

MELFs Provide Lower Heat Rise Compared to SMD Flat Chip Resistors

MELFs Provide Lower Heat Rise Compared to SMD Flat Chip Resistors

ON Semiconductor Reports Increases in Revenue and Income

ON Semiconductor Reports Increases in Revenue and Income


News Nov 04, 2013 by Jeff Shepard
Monolithic Power Aims for Si / SiC Cost Parity within 4 Years

Monolithic Power Aims for Si / SiC Cost Parity within 4 Years


News Nov 04, 2013 by Jeff Shepard
Dialog’s Class D Speaker Driver IC Brings 3X Power Output to Ultrabooks

Dialog’s Class D Speaker Driver IC Brings 3X Power Output to Ultrabooks

Anvil Drops the Hammer on £1m to Develop Low-Cost SiC Power Devices

Anvil Drops the Hammer on £1m to Develop Low-Cost SiC Power Devices


News Oct 31, 2013 by Jeff Shepard