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Fourth-Gen HV Amplifier IC offered in Single- and Dual-Channel Designs

Fourth-Gen HV Amplifier IC offered in Single- and Dual-Channel Designs

High-Temperature SiC Junction Transistors in Hermetic Packages

High-Temperature SiC Junction Transistors in Hermetic Packages

Stackpole Claims Lowest Heat Rise In A 2512 Size Chip Resistor

Stackpole Claims Lowest Heat Rise In A 2512 Size Chip Resistor

Polymer Ta Chip Capacitors for High-Energy Uses such as Smart Meters and Xmtrs

Polymer Ta Chip Capacitors for High-Energy Uses such as Smart Meters and Xmtrs

Energy-Harvesting IC aims to Broaden Benefits of Battery-Free Technology

Energy-Harvesting IC aims to Broaden Benefits of Battery-Free Technology

Toshiba Launches Qi Compliant Wireless Power Receiver IC with Low Heat Generation

Toshiba Launches Qi Compliant Wireless Power Receiver IC with Low Heat Generation

Trinamic Claims World’s Lowest Cost Single-Axis Motion Controller IC

Trinamic Claims World’s Lowest Cost Single-Axis Motion Controller IC

Split-Output Topology Improves Dynamic Behavior in SiC MOSFET Modules

Split-Output Topology Improves Dynamic Behavior in SiC MOSFET Modules

10A Gate Drive IC Shrinks Automotive High-Current Switching Systems

10A Gate Drive IC Shrinks Automotive High-Current Switching Systems

VPG Extends Z-Foil Ultra-High-Precision Flip Chip COTS Resistors Down to 5 Ω

VPG Extends Z-Foil Ultra-High-Precision Flip Chip COTS Resistors Down to 5 Ω

Toshiba Launches Load Switch IC claiming Industry’s Lowest ON Resistance

Toshiba Launches Load Switch IC claiming Industry’s Lowest ON Resistance

Altera Demonstrates Integrated PLC and HMI System on a Single Chip

Altera Demonstrates Integrated PLC and HMI System on a Single Chip

RAVS Series Anti-Sulfur Chip Resistor Arrays

RAVS Series Anti-Sulfur Chip Resistor Arrays

BLDC IC Enables Accurate Pump Control in Cars fitted with Idling-Reduction Systems

BLDC IC Enables Accurate Pump Control in Cars fitted with Idling-Reduction Systems

SiC Schottky Diodes in SMB (DO-214) packages offer smallest footprints

SiC Schottky Diodes in SMB (DO-214) packages offer smallest footprints

Power Integrations Completes Rollout of LYTSwitch-4 LED-Driver IC Family

Power Integrations Completes Rollout of LYTSwitch-4 LED-Driver IC Family

Single-Chip Solution Extends Smart Phone and Tablet Battery Life

Single-Chip Solution Extends Smart Phone and Tablet Battery Life

Cadence Launches Voltus IC Power Integrity Solution

Cadence Launches Voltus IC Power Integrity Solution


News Nov 11, 2013 by Jeff Shepard
High-Frequency Two-Switch-Forward IC Cuts System Cost and Footprint

High-Frequency Two-Switch-Forward IC Cuts System Cost and Footprint

Silicon Carbide Bare Die up to 8000V from GeneSiC

Silicon Carbide Bare Die up to 8000V from GeneSiC