Toshiba Launches Qi Compliant Wireless Power Receiver IC with Low Heat Generation

Toshiba Corporation announced the launch of the TC7761WBG, a wireless power receiver IC that complies with Qi Standard Low-Power Specifications version 1.1, defined by the Wireless Power Consortium (WPC). The IC will be used in electromagnetic induction wireless power supply applications, such as smartphones and mobile accessories. Mass production shipments start immediately.

ICs used in mobile applications including smartphones, are required to generate heat at low level, to prevent overheating. The TC7761WB is fabricated with a combined CMOS-DMOS wafer process that cuts heat generation to 70% that of an equivalent product while achieving 95% power conversion efficiency. The IC’s built-in protocol authentication circuit eliminates the need for an external microcontroller, contributing to simplification of the system.

Key features of the new device include: Reduces heat generation by 30%. Achieves 95% maximum power conversion efficiency. Integrates protocol authentication circuit of Qi standard. Complies with Qi Low Power Specifications version1.1 that includes FOD (Foreign Object Detection) function. Awarded Qi certification at output power of 3.5W with a maximum capability of 5W. The TC7761WB is available in a WCSP28 package and the cost for samples is 300 Yen.