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2.38 mOhm Dual MOSFET for Battery Protection

2.38 mOhm Dual MOSFET for Battery Protection

3D Silicon Lithium-Ion Battery in Pilot Production

3D Silicon Lithium-Ion Battery in Pilot Production


News Jun 21, 2016 by Jeff Shepard
25A / 650V Hermetic SiC FETs handle 225 Degrees C

25A / 650V Hermetic SiC FETs handle 225 Degrees C

12mm2 60V N-channel Power MOSFET with Low On-Resistance

12mm2 60V N-channel Power MOSFET with Low On-Resistance

Texas Instruments introduces a new 60-V N-channel FemtoFET power transistor that provides the industry’s lowest resistance


1.2-mm² 60-V 54mΩ N-channel MOSFET

1.2-mm² 60-V 54mΩ N-channel MOSFET

Delivering first SiC Intelligent Power Modules to Thales

Delivering first SiC Intelligent Power Modules to Thales

This article discusses the announcement of the delivery of the CISSOID's first prototype of 3-phase 1200V/100A SiC MOSFET IPMs to Thales…


new products Jun 16, 2016 by CISSOID
Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

This article introduces the new IGBT module generation of Mitsubishi Electric with improved Insulated Metal Baseplate as a key element of the…


WPG Americas pens Distribution Agreement with Seoul Semiconductor

WPG Americas pens Distribution Agreement with Seoul Semiconductor


News Jun 14, 2016 by Jeff Shepard
Keeping Cool with a Black Semiconductor

Keeping Cool with a Black Semiconductor


News Jun 13, 2016 by Jeff Shepard
Laminated Busbar Enabling High Frequency High Voltage and High Temperature Electronics

Laminated Busbar Enabling High Frequency High Voltage and High Temperature Electronics

Mersen presented its unique solution to get the best of the 2 worlds: high T° (up to 200°C) and low inductance laminated busbar for power module…


new products Jun 13, 2016 by Mersen
SDK Expands High-Grade SiC Epitaxial Wafer Capacity

SDK Expands High-Grade SiC Epitaxial Wafer Capacity


News Jun 08, 2016 by Jeff Shepard
Enhanced GaN-on-Silicon Epiwafers at be Unveiled

Enhanced GaN-on-Silicon Epiwafers at be Unveiled


News Jun 08, 2016 by Jeff Shepard
Improving Thermal Performance with Chip-Scale Packaged Gallium Nitride Transistors

Improving Thermal Performance with Chip-Scale Packaged Gallium Nitride Transistors

This article discusses the advantages of chip-scale packaging of GaN transistors by evaluating its thermal performance and efficiency.


Podium Session at PCIM Europe Marks New Chapter in GaN Power Device Adoption

Podium Session at PCIM Europe Marks New Chapter in GaN Power Device Adoption

Over the years, GaN power has been sarcastically described as “the technology of the future…and always will be.”  While silicon carbide devices


tech insights Jun 06, 2016 by Greg Evans
GaN Device claims Highest Efficiency at Highest Frequency

GaN Device claims Highest Efficiency at Highest Frequency

SP1026 Series 30kV TVS Diode Arrays Help Prevent Equipment Damage from Electrostatic Discharges

SP1026 Series 30kV TVS Diode Arrays Help Prevent Equipment Damage from Electrostatic Discharges

Littelfuse, Inc. has introduced the SP1026 Series 15pF 30kV Bidirectional Discrete TVS Diode Array


new products Jun 02, 2016 by Littelfuse
High Current Power MOSFET with Current Mirror and Temperature Sense Diodes

High Current Power MOSFET with Current Mirror and Temperature Sense Diodes

This article discusses the advantages of IXYS' MMIXT132N50P3 with current mirror to monitor the drain current and its various applications.


Recent Advancements in IGCT Technologies for High-Power Electronics Applications

Recent Advancements in IGCT Technologies for High-Power Electronics Applications

This article discusses the main features which make the IGCT an attractive option for high power applications with respect to the technology…


Simplify Power Electronics Design with GaN Power ICs

Simplify Power Electronics Design with GaN Power ICs

This article highlights Gallium Nitride's (GAN) advantages over silicon in terms of performance to finally displace silicon in power devices.


Overcoming Challenges in Driving Silicon Carbide Power Modules

Overcoming Challenges in Driving Silicon Carbide Power Modules

This article discusses the advancements of AgileSwitch in Programmable Gate Drivers.