Latest ICs Articles

Unlock the Full Potential of SiC MOSFET Modules

This article highlights AgileSwitch Augmented Switching Accelerated Development Kit or ASDAK for power electronics engineers working with SiC…

new products Jun 12, 2019 by Agile Switch

Automotive System Basis Chip Integrates CAN FD Controller and Transceiver

new products Jun 11, 2019 by Paul Shepard

MORNSUN Introduces New 616A Nonisolated POL DCDC Converter K12T Series

This article highlights MORNSUN non-isolated POL DC/DC converters K12T series offers compact SMD package and can supply…

This article highlights MORNSUN non-isolated POL DC/DC converters K12T series offers compact SMD package and can supply high-speed transient response.

new products Jun 11, 2019 by MORNSUN

Chip Design Dramatically Reduces Energy Needed to Compute with Light

News Jun 08, 2019 by Paul Shepard

New 2D Semiconductor Found to Have 1.7 Electron Volt Bandgap

News Jun 07, 2019 by Scott McMahan

3300V Scaled Silicon IGBTs Driven by 5V Gate Voltage

News Jun 06, 2019 by Paul Shepard

KEMET T598 Tantalum Polymer Capacitors Set New Performance Benchmarks to Drive Megatrend Applications in Automotive and Super Computing

This article highlights KEMET T598 devices that address the stringent requirements and new challenges presented by…

This article highlights KEMET T598 devices that address the stringent requirements and new challenges presented by megatrend applications in…

new products Jun 06, 2019 by KEMET Electronics Corporation

250W Non-Isolated SIP DC-DC Converter Uses 60 Less PCB Area

This article highlights TDK Corporation introduction of the 250W rated SIP models to the TDK-Lambda i6A4W product family…

This article highlights TDK Corporation introduction of the 250W rated SIP models to the TDK-Lambda i6A4W product family of non-isolated DC-DC…

new products Jun 06, 2019 by TDK Corporation

Optimized Inverter Design by IPMs and SiC-SBDs

This article highlights Roland R. Ackermann discussion about Inverter Design by IPMs and SiC-SBDs presented at PCIM…

This article highlights Roland R. Ackermann discussion about Inverter Design by IPMs and SiC-SBDs presented at PCIM Europe 2019 press conference.

Technical Articles Jun 06, 2019 by Roland R. Ackerman

Polymer Tantalum Chip Capacitors with ESR Down to 7mΩ

new products Jun 05, 2019 by Paul Shepard

GaN-on-SiC Transistor for 2.45GHz RF Surpasses Efficiency of Most Magnetrons

News Jun 05, 2019 by Scott McMahan

Silicon Carbide SiC Products for High-Voltage Reliable Power Electronics

This article highlights Microchip’s 700V SiC MOSFETs, and 700V and 1200V SiC Schottky Barrier Diodes (SBDs) join its…

This article highlights Microchip’s 700V SiC MOSFETs, and 700V and 1200V SiC Schottky Barrier Diodes (SBDs) join its existing portfolio of SiC…

new products Jun 05, 2019 by Microchip Technology Inc.

European Research Project Power2Power for More Efficient Power Semiconductors Launches in Dresden

The European cooperation project Power2Power has started. Over the coming three years, 43 partners from eight countries…

The European cooperation project Power2Power has started. Over the coming three years, 43 partners from eight countries will research and develop…

new products Jun 05, 2019 by Infineon Technologies

Underlying Material Defect Uncovered in Silicon Solar Cells Limits Performance

News Jun 04, 2019 by Scott McMahan

Tektronix Launches New 3 Series MDO and 4 Series MSO

This article highlights Tektronix launch of the 3 Series Mixed Domain Oscilloscope (MDO) and 4 Series Mixed Signal…

This article highlights Tektronix launch of the 3 Series Mixed Domain Oscilloscope (MDO) and 4 Series Mixed Signal Oscilloscope (MSO) on the market.

new products Jun 04, 2019 by Tektronix

EPC to Provide eGaN Power Devices in Wafer Form

Efficient Power Conversion (EPC) will provide their industry-leading gallium nitride-based power devices in wafer form…

Efficient Power Conversion (EPC) will provide their industry-leading gallium nitride-based power devices in wafer form for ease of power systems…

new products Jun 04, 2019 by EPC

Powering the World with Technology that Achieves More and Consumes Less

This article highlights Roland R. Ackermann discussion about Infineon power products at PCIM2019 such as CoolSiC, CoolGaN…

This article highlights Roland R. Ackermann discussion about Infineon power products at PCIM2019 such as CoolSiC, CoolGaN devices, and new…

Technical Articles Jun 04, 2019 by Roland R. Ackerman

Galvanic-Isolated IGBT Gate Driver IC Evaluation Board

News Jun 03, 2019 by Paul Shepard

Infineon to Acquire Cypress Strengthening and Accelerating its Path of Profitable Growth

Infineon Technologies AG and Cypress Semiconductor Corporation today announced that the companies have signed a…

Infineon Technologies AG and Cypress Semiconductor Corporation today announced that the companies have signed a definitive agreement under which…

new products Jun 03, 2019 by Infineon Technologies

Isolated CAN Transceiver Reference Board from Dengrove Solves Circuit Design and Protection Challenges

Dengrove Electronic Components announces the RECOM R-REF03-CAN1 reference board, which streamlines the design of an…

Dengrove Electronic Components announces the RECOM R-REF03-CAN1 reference board, which streamlines the design of an isolated CAN interface.

new products Jun 03, 2019 by Dengrove Electronics