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14mm PD GaN Charger at MWC Barcelona 2019

14mm PD GaN Charger at MWC Barcelona 2019

News Feb 28, 2019 by Paul Shepard
Transphorm’s Gen III GaN Platform Earns Automotive Qualification

Transphorm’s Gen III GaN Platform Earns Automotive Qualification

News Feb 28, 2019 by Paul Shepard
EPC Publishes 10th Reliability Report Highlighting GaN Device Testing Beyond AEC-Q101

EPC Publishes 10th Reliability Report Highlighting GaN Device Testing Beyond AEC-Q101

News Feb 26, 2019 by Paul Shepard
Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

new products Feb 25, 2019 by Scott McMahan
MACOM and STMicro Expand GaN-on-Si Capacity for 5G Rollout

MACOM and STMicro Expand GaN-on-Si Capacity for 5G Rollout

News Feb 25, 2019 by Scott McMahan
Denso, Sonnen, and Supermicro Join GaN Systems Presenting at APEC 2019

Denso, Sonnen, and Supermicro Join GaN Systems Presenting at APEC 2019

News Feb 22, 2019 by Scott McMahan
ASIL-D Real-Time Automotive MCUs with 40MB of On-Chip Memory

ASIL-D Real-Time Automotive MCUs with 40MB of On-Chip Memory

new products Feb 21, 2019 by Scott McMahan
ROHM Announces New HighReliability 1608Size White Chip LED

ROHM Announces New HighReliability 1608Size White Chip LED

ROHM today announced the availability of the SMLD12WBN1W, a White chip LED with 1608 (1.6x0.8mm) size that achieves class-leading reliability. This…

new products Feb 21, 2019 by ROHM
H-Bridge Driver IC with Integrated Arm Cortex M0 for Automotive

H-Bridge Driver IC with Integrated Arm Cortex M0 for Automotive

new products Feb 20, 2019 by Paul Shepard
3.0kW Single-Phase Inverter GaN Evaluation Platform

3.0kW Single-Phase Inverter GaN Evaluation Platform

new products Feb 15, 2019 by Paul Shepard
Vicor Introduces Four New Tightly Regulated DC-DC Converter ChiP Modules

Vicor Introduces Four New Tightly Regulated DC-DC Converter ChiP Modules

The new entries in the extensive DCM™ family are available in the 3623(36 x 23mm) ChiP (Converter housed in Package™) with an unrivaled power…

new products Feb 14, 2019 by Vicor
STMicroelectronics to Acquire Majority Stake in Silicon Carbide Wafer Manufacturer Norstel AB

STMicroelectronics to Acquire Majority Stake in Silicon Carbide Wafer Manufacturer Norstel AB

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced it has signed…

new products Feb 13, 2019 by STMicroelectronics
PowerSphyr and GaN Systems Partner on GaN-based Wireless Power

PowerSphyr and GaN Systems Partner on GaN-based Wireless Power

News Feb 12, 2019 by Scott McMahan
JEDEC Publishes RDS(on) Test Guidelines for GaN HEMT-Based Devices

JEDEC Publishes RDS(on) Test Guidelines for GaN HEMT-Based Devices

News Feb 11, 2019 by Scott McMahan
Leading the Way in the GaN Power Semiconductors Industry in 2019

Leading the Way in the GaN Power Semiconductors Industry in 2019

News Feb 08, 2019 by Paul Shepard
40Vds GaN FETs in 20-Amp Half-Bridge Development Board

40Vds GaN FETs in 20-Amp Half-Bridge Development Board

new products Feb 07, 2019 by Paul Shepard
ECPE Announces the Final Program for SiC and GaN User Forum Potential of Wide Bandgap Semiconductors in Power Electronic Applications

ECPE Announces the Final Program for SiC and GaN User Forum Potential of Wide Bandgap Semiconductors in Power Electronic Applications

ECPE is pleased to present the final program for the ECPE Workshop 'SiC & GaN User Forum: Potential of Wide Bandgap Semiconductors in…

new products Feb 07, 2019 by ECPE
Alpha and Omega Semiconductor Continues to Expand its Fifth Generation EZBuck Family

Alpha and Omega Semiconductor Continues to Expand its Fifth Generation EZBuck Family

Alpha and Omega Semiconductor Limited (AOS) today introduced  AOZ6662DI-01 and AOZ6663DI-01, high efficiency, simple-to-use synchronous buck…

new products Feb 07, 2019 by Alpha and Omega Semiconductor
3.3µF to 680µF Polymer Tantalum Molded Chip Capacitors Now in Z Case

3.3µF to 680µF Polymer Tantalum Molded Chip Capacitors Now in Z Case

new products Feb 06, 2019 by Scott McMahan
IWIPP 2019 to Address Wide Bandgap Semiconductor Power Packaging Challenges

IWIPP 2019 to Address Wide Bandgap Semiconductor Power Packaging Challenges

The International Workshop on Integrated Power Packaging announces IWIPP 2019, to be held in Toulouse, France, April 24-26, 2019.

new products Feb 06, 2019 by IWIPP