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Aveox to Launch Ultrahigh Efficiency AC Power Conversion Modules with APFC Powered by GaN Systems

Aveox to Launch Ultrahigh Efficiency AC Power Conversion Modules with APFC Powered by GaN Systems

GaN Systems announces a strategic partnership with Aveox to significantly reduce the size and weight of their 3-phase AC power converters with APFC.


new products Mar 18, 2019 by GaN Systems
Silanna Semiconductor Unveils World’s First Fully Integrated Active Clamp Flyback Controller

Silanna Semiconductor Unveils World’s First Fully Integrated Active Clamp Flyback Controller

Silanna Semiconductor recently unveiled the world’s first fully integrated active clamp flyback (ACF) controller for designing high-power-density…


100V GaN Transistor for 48V DC-DCs, Motor Drives and LiDAR

100V GaN Transistor for 48V DC-DCs, Motor Drives and LiDAR

Three Things Engineers Should Consider When Using GaN and SiC in Power Electronics

Three Things Engineers Should Consider When Using GaN and SiC in Power Electronics


News Mar 14, 2019 by Paul Shepard
Panasonic Showcases GaN/SiC Power Devices at APEC 2019

Panasonic Showcases GaN/SiC Power Devices at APEC 2019


News Mar 13, 2019 by Scott McMahan
ON Semiconductor to Demonstrate Rapid Analysis of Power Solutions Using Advanced Cloud-Connected Strata Developer Studio at APEC 2019

ON Semiconductor to Demonstrate Rapid Analysis of Power Solutions Using Advanced Cloud-Connected Strata Developer Studio at APEC 2019

This article features ON Semiconductor Strata Developer Studio™ development platform that facilitates the rapid and easy evaluation of solutions.


new products Mar 13, 2019 by onsemi
SiC MOSFET and GaN FET Switching Power Converter Analysis Kit

SiC MOSFET and GaN FET Switching Power Converter Analysis Kit

20 Million GaN Reliability Hours at Texas Instruments

20 Million GaN Reliability Hours at Texas Instruments


News Mar 11, 2019 by Paul Shepard
Power America Showcases Wide Bandgap Power Electronics Progress at APEC 2019

Power America Showcases Wide Bandgap Power Electronics Progress at APEC 2019


News Mar 07, 2019 by Scott McMahan
EPC to Present GaN Vision at APEC 2019

EPC to Present GaN Vision at APEC 2019

Transphorms Gen III GaN Platform Earns Automotive Qualification

Transphorms Gen III GaN Platform Earns Automotive Qualification

Transphorm Inc.—the leader in the design and manufacturing of the highest reliability and first JEDEC- and AEC-Q101 qualified 650 V gallium…


new products Mar 07, 2019 by Transphorm
3.5A to 11A, 650V GaN Transistors Target Consumer Applications

3.5A to 11A, 650V GaN Transistors Target Consumer Applications

GaN Systems Debuts Suite of Low Cost High Performance GaN Power Transistors

GaN Systems Debuts Suite of Low Cost High Performance GaN Power Transistors

GaN Systems announced the availability of the GS-065 low current transistor line.


new products Mar 05, 2019 by GaN Systems
New Power-Supply Transformers Complement Power Integrations SCALEiDriver GateDriver IC Family

New Power-Supply Transformers Complement Power Integrations SCALEiDriver GateDriver IC Family

Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced a range of…


GaN Power ICs Handle 27W to 3.2kW for Next-Gen Power Converters

GaN Power ICs Handle 27W to 3.2kW for Next-Gen Power Converters


News Mar 04, 2019 by Scott McMahan
ON Semiconductor Opens Bangalore Facility to Integrate Operations in India

ON Semiconductor Opens Bangalore Facility to Integrate Operations in India


News Mar 03, 2019 by Scott McMahan
40V Three-Phase Sensorless Sinusoidal Fan Driver IC Minimizes Vibration & Noise

40V Three-Phase Sensorless Sinusoidal Fan Driver IC Minimizes Vibration & Noise

Hans Keller joins Höganäs as new President for Product Area Surface and Joining Technologies

Hans Keller joins Höganäs as new President for Product Area Surface and Joining Technologies

Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.


new products Mar 01, 2019 by Hoganas
JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

 JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices


new products Mar 01, 2019 by JEDEC
Power Module Substrate Options Available to Lower Semiconductor Junction Temperatures for Increased Reliability

Power Module Substrate Options Available to Lower Semiconductor Junction Temperatures for Increased Reliability

This article examines changing a power module's substrate as a possible option for lowering its semiconductors junction temperatures without…