GaN Systems announces a strategic partnership with Aveox to significantly reduce the size and weight of their 3-phase AC power converters with APFC.
GaN Systems announces a strategic partnership with Aveox to significantly reduce the size and weight of their 3-phase AC power converters with APFC.
Silanna Semiconductor recently unveiled the world’s first fully integrated active clamp flyback (ACF) controller for…
Silanna Semiconductor recently unveiled the world’s first fully integrated active clamp flyback (ACF) controller for designing high-power-density…
This article features ON Semiconductor Strata Developer Studio™ development platform that facilitates the rapid and…
This article features ON Semiconductor Strata Developer Studio™ development platform that facilitates the rapid and easy evaluation of solutions.
Transphorm Inc.—the leader in the design and manufacturing of the highest reliability and first JEDEC- and AEC-Q101…
Transphorm Inc.—the leader in the design and manufacturing of the highest reliability and first JEDEC- and AEC-Q101 qualified 650 V gallium…
GaN Systems announced the availability of the GS-065 low current transistor line.
GaN Systems announced the availability of the GS-065 low current transistor line.
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today…
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced a range of…
Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.
Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.
JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power…
JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices
This article examines changing a power module's substrate as a possible option for lowering its semiconductors junction…
This article examines changing a power module's substrate as a possible option for lowering its semiconductors junction temperatures without…