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Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

This article highlights Advanced Packaging Center and Alpha Assembly Solutions Silver (Ag) sintering proven and reliable bonding technology for…

Technical Articles Feb 27, 2017 by Marco Koelink
Transphorm to Rev High-Voltage GaN at APEC

Transphorm to Rev High-Voltage GaN at APEC

News Feb 22, 2017 by Power Pulse1595211359
Bulk AlN Platform for GaN High Voltage and Power

Bulk AlN Platform for GaN High Voltage and Power

News Feb 20, 2017 by Jeff Shepard
Integrated Half-Bridge GaN Power IC

Integrated Half-Bridge GaN Power IC

new products Feb 20, 2017 by Power Pulse1595211359
160W and 375W DC-DCs in 0.29” High ChiP Packaging

160W and 375W DC-DCs in 0.29” High ChiP Packaging

new products Feb 16, 2017 by Jeff Shepard
Low-Leakage, Doping-Free 600V GaN HEMT Epiwafers

Low-Leakage, Doping-Free 600V GaN HEMT Epiwafers

News Feb 15, 2017 by Jeff Shepard
GaNonCMOS Project Aims for GaN Commercialization

GaNonCMOS Project Aims for GaN Commercialization

News Feb 14, 2017 by Jeff Shepard
Automotive Three-Phase Isolated MOSFET Driver IC

Automotive Three-Phase Isolated MOSFET Driver IC

new products Feb 14, 2017 by Jeff Shepard
Unidirectional Linear Hall Sensor IC in Surface-Mount Package

Unidirectional Linear Hall Sensor IC in Surface-Mount Package

This article features Allegro Microsystems' ALS31000, a unidirectional linear Hall sensor integrated circuit for automotive and industrial…

new products Feb 14, 2017 by Allegro MicroSystems
Unidirectional ESD Protection in 01005 Flip Chip Package

Unidirectional ESD Protection in 01005 Flip Chip Package

new products Feb 13, 2017 by Jeff Shepard
Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Littelfuse, Inc. introduces its new series of three unidirectional TVS diode arrays in space-saving 01005 flip-chip packages

new products Feb 13, 2017 by Littelfuse
GaN Transistor Gate Drive Optocouplers

GaN Transistor Gate Drive Optocouplers

This article features Broadcom's Gallium Nitride (GaN) Transistor Gate Drive Optocouplers and discusses its advantages, marketing, drive and…

Technical Articles Feb 13, 2017 by Robinson Law
Seven DCMs in a ChiP Package

Seven DCMs in a ChiP Package

Vicor introduces seven new DCMs in a ChiP package that generate an isolated DC output

new products Feb 10, 2017 by Vicor
£4.3 Million for GaN-on-Diamond Microwave Power

£4.3 Million for GaN-on-Diamond Microwave Power

News Feb 09, 2017 by Jeff Shepard
Automotive Thin-Film Chip Caps with Low ESR and High Q

Automotive Thin-Film Chip Caps with Low ESR and High Q

new products Feb 09, 2017 by Jeff Shepard
650V GaN Power ICs get Production Qualification

650V GaN Power ICs get Production Qualification

News Feb 06, 2017 by Jeff Shepard
PoE IC Delivers 123W over 1Gbps CAT5e Cable

PoE IC Delivers 123W over 1Gbps CAT5e Cable

new products Feb 06, 2017 by Jeff Shepard
GaN Transistor Thermal RC Models Enhance SPICE Simulations

GaN Transistor Thermal RC Models Enhance SPICE Simulations

new products Feb 02, 2017 by Jeff Shepard
Wireless Power Transmit IC Sends Power Over Distance

Wireless Power Transmit IC Sends Power Over Distance

News Jan 29, 2017 by Jeff Shepard
The Creation of Silicon Carbide Revolutionary Semiconductor

The Creation of Silicon Carbide Revolutionary Semiconductor

This article highlights SiCrystal AG and Rohm Semiconductor GmbH for the potential of Silicon Carbide material for power and RF electronics…

Technical Articles Jan 25, 2017 by Robert Eckstein