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GaN Customer Solutions to Take Center Stage

GaN Customer Solutions to Take Center Stage

GaN FETs Extend Cost/Performance Benefits over Silicon

GaN FETs Extend Cost/Performance Benefits over Silicon

GaN Power ICs and Ten Technical Papers on Show in Tampa

GaN Power ICs and Ten Technical Papers on Show in Tampa

RFHIC acquiring GaN-on-Diamond Tech from E6

RFHIC acquiring GaN-on-Diamond Tech from E6


News Mar 09, 2017 by Jeff Shepard
EPC to Showcase Life-Changing Applications Using GaN

EPC to Showcase Life-Changing Applications Using GaN

GaN-on-Si Devices Show No Degradation from Irradiation

GaN-on-Si Devices Show No Degradation from Irradiation


News Mar 07, 2017 by Jeff Shepard
Single-chip 2.4GHz Transceiver for Wireless ZigBee and IoT

Single-chip 2.4GHz Transceiver for Wireless ZigBee and IoT

Dual-Mode IC Supports Bluetooth Classic and LE 4.2

Dual-Mode IC Supports Bluetooth Classic and LE 4.2

Swatch Claims the World’s Smallest Bluetooth Chip

Swatch Claims the World’s Smallest Bluetooth Chip


News Mar 05, 2017 by Jeff Shepard
Opening of Blacksburg Virginia eGaN FET and IC Applications Center

Opening of Blacksburg Virginia eGaN FET and IC Applications Center

Efficient Power Conversion Corporation (EPC) is proud to announce the opening of an Applications Center in Blacksburg, Virginia.  


new products Mar 03, 2017 by EPC
High Voltage Ceramic Chip Capacitors Evaluated Acoustically

High Voltage Ceramic Chip Capacitors Evaluated Acoustically

This article discusses how acoustic micro imaging tools work and how it helps detect and keep defective capacitors out of production.


GaN enables Wide-Input and Compact 12W DC-DCs

GaN enables Wide-Input and Compact 12W DC-DCs


News Mar 02, 2017 by Jeff Shepard
SOI Wafer is a Suitable Substrate for GaN Crystals

SOI Wafer is a Suitable Substrate for GaN Crystals


News Mar 02, 2017 by Jeff Shepard
Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

This article highlights Advanced Packaging Center and Alpha Assembly Solutions Silver (Ag) sintering proven and reliable bonding technology for…


Transphorm to Rev High-Voltage GaN at APEC

Transphorm to Rev High-Voltage GaN at APEC

Bulk AlN Platform for GaN High Voltage and Power

Bulk AlN Platform for GaN High Voltage and Power


News Feb 20, 2017 by Jeff Shepard
Integrated Half-Bridge GaN Power IC

Integrated Half-Bridge GaN Power IC

160W and 375W DC-DCs in 0.29” High ChiP Packaging

160W and 375W DC-DCs in 0.29” High ChiP Packaging

Low-Leakage, Doping-Free 600V GaN HEMT Epiwafers

Low-Leakage, Doping-Free 600V GaN HEMT Epiwafers


News Feb 15, 2017 by Jeff Shepard
GaNonCMOS Project Aims for GaN Commercialization

GaNonCMOS Project Aims for GaN Commercialization


News Feb 14, 2017 by Jeff Shepard