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ROHM Claims First Mass-Produced SiC MOS Module Without a Schottky Diode

ROHM Claims First Mass-Produced SiC MOS Module Without a Schottky Diode

new products Feb 18, 2013 by Jeff Shepard
Mitsubishi to Launch MOSFET-based Super-mini DIPIPM for 3-Phase Inverters

Mitsubishi to Launch MOSFET-based Super-mini DIPIPM for 3-Phase Inverters

new products Feb 17, 2013 by Jeff Shepard
Renesas Unveils Low-Power Microcontroller Group with up to 1MB of On-Chip Flash

Renesas Unveils Low-Power Microcontroller Group with up to 1MB of On-Chip Flash

new products Feb 17, 2013 by Jeff Shepard
Alpha and Omega Releases Robust 600V AlphaMOS-II MOSFET Family

Alpha and Omega Releases Robust 600V AlphaMOS-II MOSFET Family

new products Feb 14, 2013 by Jeff Shepard
Mitsubishi Electric Develops 1,200V/1,200A SiC Power Module Technologies

Mitsubishi Electric Develops 1,200V/1,200A SiC Power Module Technologies

new products Feb 13, 2013 by Jeff Shepard
Battery “Fuel Gauge” IC Gives Reliable Runtimes for Mobile Users

Battery “Fuel Gauge” IC Gives Reliable Runtimes for Mobile Users

new products Feb 13, 2013 by Jeff Shepard
U.S. Unveiling of Digital Controller Technology for Solid-State Lighting by Ikon Semiconductor

U.S. Unveiling of Digital Controller Technology for Solid-State Lighting by Ikon Semiconductor

new products Feb 11, 2013 by Jeff Shepard
IGBT/MOSFET Gate Drive Coupler from Toshiba Saves Power and Reduces Mounting Area by 50%

IGBT/MOSFET Gate Drive Coupler from Toshiba Saves Power and Reduces Mounting Area by 50%

new products Feb 11, 2013 by Jeff Shepard
Vishay Extends Precision Series of Wide-Terminal Thin-Film Chip Resistors with Values Down to 1 Ohm

Vishay Extends Precision Series of Wide-Terminal Thin-Film Chip Resistors with Values Down to 1 Ohm

new products Feb 07, 2013 by Jeff Shepard
EPC Development Board Demonstrates Ease of Designing Power Systems with 200V eGaN FETs

EPC Development Board Demonstrates Ease of Designing Power Systems with 200V eGaN FETs

News Feb 05, 2013 by Jeff Shepard
1366 Technologies Opens “Transformative” PV Wafer Factory

1366 Technologies Opens “Transformative” PV Wafer Factory

News Feb 05, 2013 by Jeff Shepard
Toshiba Launches 2.0A USB-Ready Li-Ion Charger IC that Fast Charges Portable Devices

Toshiba Launches 2.0A USB-Ready Li-Ion Charger IC that Fast Charges Portable Devices

new products Feb 05, 2013 by Jeff Shepard
TDK Offers Semiconductor-Embedded-in-Substrate Power Management Module for Smartphones and Tablets

TDK Offers Semiconductor-Embedded-in-Substrate Power Management Module for Smartphones and Tablets

new products Feb 04, 2013 by Jeff Shepard
TI Power Management Front-End Chip Targeted at ARM Cortex A15-Based Designs

TI Power Management Front-End Chip Targeted at ARM Cortex A15-Based Designs

new products Feb 03, 2013 by Jeff Shepard
Expanded Resistance Range for KOA’s Thick-Film Chip Resistors

Expanded Resistance Range for KOA’s Thick-Film Chip Resistors

new products Jan 31, 2013 by Jeff Shepard
Raytheon Achieves UK First with Opening of New Silicon-Carbide Foundry

Raytheon Achieves UK First with Opening of New Silicon-Carbide Foundry

News Jan 30, 2013 by Jeff Shepard
Allegro Adds Dual Analog/PWM Programmable Linear IC for Applications Requiring Output Redundancy

Allegro Adds Dual Analog/PWM Programmable Linear IC for Applications Requiring Output Redundancy

new products Jan 30, 2013 by Jeff Shepard
Toshiba’s Latest MOSFET Intro Adds “DPAK+” Package Suited for High-Speed Switching

Toshiba’s Latest MOSFET Intro Adds “DPAK+” Package Suited for High-Speed Switching

new products Jan 24, 2013 by Jeff Shepard
TowerJazz and OnSemi Collaborate on Programmable PMIC for LCD and AMOLED Panels

TowerJazz and OnSemi Collaborate on Programmable PMIC for LCD and AMOLED Panels

News Jan 22, 2013 by Jeff Shepard
Arctic Sand Nabs Funding to Commercialize Switched-Capacitance Power Conversion Technology

Arctic Sand Nabs Funding to Commercialize Switched-Capacitance Power Conversion Technology

News Jan 16, 2013 by Jeff Shepard