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25-mOhm / 1700-V SiC Transistors

25-mOhm / 1700-V SiC Transistors

Precision Thin-Film Chip Resistors offer Enhanced Performance

Precision Thin-Film Chip Resistors offer Enhanced Performance

Single-Chip, Grid-Connected Signal Controller for IoT Applications

Single-Chip, Grid-Connected Signal Controller for IoT Applications

Wide-Input, 20 Amp GaN-Based Buck Converter Demo Board

Wide-Input, 20 Amp GaN-Based Buck Converter Demo Board

Thermal Efficiency of Chipscale Packaging for eGaN® FETs

Thermal Efficiency of Chipscale Packaging for eGaN® FETs

This article discusses the thermal performance of the chipscale package and compare with the state-of-the-art power MOSFET packaging available today.


PowerSoCs Designed for Automotive Systems

PowerSoCs Designed for Automotive Systems

Fully-Integrated LED Matrix Manager for Adaptive Headlights

Fully-Integrated LED Matrix Manager for Adaptive Headlights

GaN Textbook Focuses on Power Conversion Applications

GaN Textbook Focuses on Power Conversion Applications


News Oct 14, 2014 by Jeff Shepard
System-on-Chip for Smart Metering Platforms

System-on-Chip for Smart Metering Platforms

IGBT Modules Offer Integrated Solutions for Solar Inverters and UPS

IGBT Modules Offer Integrated Solutions for Solar Inverters and UPS

SiC Power MOSFET SPICE Models from Cree

SiC Power MOSFET SPICE Models from Cree

20A All-SiC 1.2kV Six-Pack for 5-15kW Three-Phase Designs

20A All-SiC 1.2kV Six-Pack for 5-15kW Three-Phase Designs

The Expanding Markets for GaN Technology

The Expanding Markets for GaN Technology

This article discusses the expanding markets for GaN technology and offers some insights and reasons why it is better than their silicon-counterparts.


New Products from Vishay on Display at electronica

New Products from Vishay on Display at electronica

Room-Temperature Covalent Bonder for Power Device Production

Room-Temperature Covalent Bonder for Power Device Production

125Vac-rated High Inrush Type Chip Fuses

125Vac-rated High Inrush Type Chip Fuses

October 2014 Electronics Industry Digest

October 2014 Electronics Industry Digest

The European Commission launched a € 5 billion public private partnership -ECSEL -to boost Europe’s electronics design and manufacturing…


First Single-Crystalline GaN Growth on Wafer-Scale Graphene

First Single-Crystalline GaN Growth on Wafer-Scale Graphene


News Oct 02, 2014 by Jeff Shepard
12-V Chip-scale MOSFET Cuts Power Consumption for Ultraportables

12-V Chip-scale MOSFET Cuts Power Consumption for Ultraportables

Wafer-Level Testing of Power Semiconductors

Wafer-Level Testing of Power Semiconductors