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0.9mm-High Fused High-CV Ta SMD Chip Capacitors

0.9mm-High Fused High-CV Ta SMD Chip Capacitors

eGaN Technology Transforming the Future

eGaN Technology Transforming the Future

This article discusses the potential of eGaN technology in various applications such as outer space, machine interface, electricity and medicine.


Developments in the AC-DC External Power Supply Market

Developments in the AC-DC External Power Supply Market

Led by a number of traditional applications within the communications, computers and consumer segments as well as a number of emerging…


Integrated DC Motor Controller IC

Integrated DC Motor Controller IC

December 2014 Electronics Industry Digest

December 2014 Electronics Industry Digest

Makers and startups, not tech providers, consumer goods companies or enterprises, will drive acceptance, use and growth in the Internet of Things…


GaN Systems names Daitron to Lead Distribution in Japan and Korea

GaN Systems names Daitron to Lead Distribution in Japan and Korea


News Dec 02, 2014 by Jeff Shepard
MOSFET Gate Drivers Boosts Conversion Efficiency

MOSFET Gate Drivers Boosts Conversion Efficiency

Making Silicon Carbide from Agricultural Waste

Making Silicon Carbide from Agricultural Waste


News Dec 01, 2014 by Jeff Shepard
Youthful Power Electronics

Youthful Power Electronics

Computer Engineering is 60 years old. Power Systems and Telecommunications are even older. Forthcoming out of these disciplines the original…


Raytheon UK Developing SiC MOSFETs for Automotive Applications

Raytheon UK Developing SiC MOSFETs for Automotive Applications


News Nov 30, 2014 by Jeff Shepard
gapDRIVE Integrated Digital Gate Drivers feature On-Chip Galvanic Isolation

gapDRIVE Integrated Digital Gate Drivers feature On-Chip Galvanic Isolation

Compact SiC Hybrid Power Modules handle 3300V and 1500A

Compact SiC Hybrid Power Modules handle 3300V and 1500A

NXP Acquires Wearable and Bluetooth Low Energy IC Business of Quintic

NXP Acquires Wearable and Bluetooth Low Energy IC Business of Quintic


News Nov 23, 2014 by Jeff Shepard
SiC DIPIPM Power Modules for PV Power Conditioning

SiC DIPIPM Power Modules for PV Power Conditioning

IC Linearizes Temperature Sensors with 0.1 Degree C Accuracy

IC Linearizes Temperature Sensors with 0.1 Degree C Accuracy

Gate Driver Board and SPICE Models for SiC Junction Transistors

Gate Driver Board and SPICE Models for SiC Junction Transistors


News Nov 20, 2014 by Jeff Shepard
High-Voltage IC Building Blocks Simplify SMPS Design

High-Voltage IC Building Blocks Simplify SMPS Design

GaN and SiC may be made Obsolete by Gallium Oxide

GaN and SiC may be made Obsolete by Gallium Oxide


News Nov 19, 2014 by Jeff Shepard
Bond Buffer – Increase Power Density and Lifetime without Changing the System

Bond Buffer – Increase Power Density and Lifetime without Changing the System

This article discusses Danfoss Bond Buffer Technology and its impact on improving power density and lifetime of power modules without changing the…


AEC-Q200-Qualified Thin Film Chip Resistors

AEC-Q200-Qualified Thin Film Chip Resistors