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0805-Sized Ceramic Chip Inductors Provide Highest Q

0805-Sized Ceramic Chip Inductors Provide Highest Q

AEC-Q100 (Grade3) Voltage Detectors with Watchdog

AEC-Q100 (Grade3) Voltage Detectors with Watchdog

W-Band GaN Transmitters Enable Longer Range / Higher Bandwidth

W-Band GaN Transmitters Enable Longer Range / Higher Bandwidth


News Jul 24, 2017 by Paul Shepard
PFC+LLC Resonance Control IC Reduces Standby Power

PFC+LLC Resonance Control IC Reduces Standby Power

Next-Generation SiC Platform for 6-inch Wafers

Next-Generation SiC Platform for 6-inch Wafers


News Jul 20, 2017 by Paul Shepard
Hermetic, Dynamic Load Balancing, Press-pack IGBT

Hermetic, Dynamic Load Balancing, Press-pack IGBT

BMW i Ventures makes Strategic Investment in GaN Systems

BMW i Ventures makes Strategic Investment in GaN Systems


News Jul 19, 2017 by Paul Shepard
Sanken North America to get $291 Million Infusion

Sanken North America to get $291 Million Infusion


News Jul 18, 2017 by Paul Shepard
Important Parameters in Choosing an Digital Storage Oscilloscopes (DSO) - Part 1

Important Parameters in Choosing an Digital Storage Oscilloscopes (DSO) - Part 1

This article discusses the important parameters to remember in choosing the right digital storage oscilloscope for designing and testing circuitry.


Investigating Losses of GaN-HFETs in a Synchronous Buck Converter

Investigating Losses of GaN-HFETs in a Synchronous Buck Converter

This article illustrates a thermal measuring method and electrical method with air-core inductors to investigate the losses in eGaNTM FETs.


Creating Many Thin Layers from a Single GaN Wafer

Creating Many Thin Layers from a Single GaN Wafer


News Jul 14, 2017 by Paul Shepard
Ultra-Fast Switching with 1200V SiC Schottky

Ultra-Fast Switching with 1200V SiC Schottky

60V Protected High Side N-Channel MOSFET Driver

60V Protected High Side N-Channel MOSFET Driver

1200V / 150A IGBT Integrated Power Modules

1200V / 150A IGBT Integrated Power Modules

HV MOSFET Platform for Improved Switching and EMI

HV MOSFET Platform for Improved Switching and EMI


News Jul 11, 2017 by Paul Shepard
Helix Semiconductor MuxCapacitor Chipset Now Sampling

Helix Semiconductor MuxCapacitor Chipset Now Sampling


News Jul 11, 2017 by Paul Shepard
Processor Family IC for Wearable Applications

Processor Family IC for Wearable Applications

“PFC + Inverter” Intelligent Power Module in 21mm x 36mm for Low Power Drives

“PFC + Inverter” Intelligent Power Module in 21mm x 36mm for Low Power Drives

This article discusses the features and advantages of intelligent power modules in terms of costs, size, thermal and overcurrent protection.


113-picoWatt Temp Sensor for Wearables and IoT Nodes

113-picoWatt Temp Sensor for Wearables and IoT Nodes


News Jul 06, 2017 by Paul Shepard
Growing GaN with Nb2N for Better Cost and Performance

Growing GaN with Nb2N for Better Cost and Performance


News Jul 06, 2017 by Paul Shepard