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Evaluating Power Integrity and More in Automotive SoC Devices

Evaluating Power Integrity and More in Automotive SoC Devices

News Oct 15, 2019 by Paul Shepard
EMC Filters for GaN- and SiC-Based Power Converters

EMC Filters for GaN- and SiC-Based Power Converters

new products Oct 15, 2019 by Paul Shepard
64-Channel High-Voltage Switch IC for Medical and Industrial Imaging

64-Channel High-Voltage Switch IC for Medical and Industrial Imaging

new products Oct 15, 2019 by Paul Shepard
AEC Q101 GaN FET Helps Time-of-Flight Lidar Systems ‘See’ Better

AEC Q101 GaN FET Helps Time-of-Flight Lidar Systems ‘See’ Better

new products Oct 15, 2019 by Paul Shepard
1-kW, 80 Plus Titanium, GaN + Silicon Digital AC-DC Power Supply Reference Design

1-kW, 80 Plus Titanium, GaN + Silicon Digital AC-DC Power Supply Reference Design

News Oct 15, 2019 by Paul Shepard
Industry-First Energy Harvesting Power Management Chip for Biometric Payment Devices

Industry-First Energy Harvesting Power Management Chip for Biometric Payment Devices

new products Oct 14, 2019 by Paul Shepard
The Intelligent Power Module Concept for Motor Drive Inverters

The Intelligent Power Module Concept for Motor Drive Inverters

This article highlights Mitsubishi Electric Europe B.V. DIPIPM™ series package that offers the highest level of integration and compactness for…

Technical Articles Oct 14, 2019 by Philipp Jabs
GaN Totem-Pole PFC Design Guide and Power Loss Modeling

GaN Totem-Pole PFC Design Guide and Power Loss Modeling

News Oct 11, 2019 by Paul Shepard
200mm Semi-Insulating SiC Substrates for RF Power Amplifiers in 5G Antennas

200mm Semi-Insulating SiC Substrates for RF Power Amplifiers in 5G Antennas

News Oct 11, 2019 by Paul Shepard
Fraunhofer IZM is Putting the Electric Car in the Fast Lane

Fraunhofer IZM is Putting the Electric Car in the Fast Lane

Fraunhofer IZM is Putting the Electric Car in the Fast Lane.

new products Oct 11, 2019 by Fraunhofer IZM
Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging

Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging

News Oct 10, 2019 by Paul Shepard
STMicroelectronics’ STSPIN Modules Add High-Performing Motor Drivers to MikroElektronika Fusion for Arm Ecosystem

STMicroelectronics’ STSPIN Modules Add High-Performing Motor Drivers to MikroElektronika Fusion for Arm Ecosystem

STSPIN Modules from STMicroelectronics Add High-Performing Motor Drivers to MikroElektronika Fusion for Arm Ecosystem.

new products Oct 10, 2019 by STMicroelectronics
ROHM Introduces New 4Pin Package SiC Mosfets

ROHM Introduces New 4Pin Package SiC Mosfets

This article highlights ROHM Semiconductors RV4xxx series development of ultra-compact 1.6x1.6mm size MOSFETs that deliver superior mounting…

new products Oct 10, 2019 by ROHM
Power Integrations Delivers OneMillionth GaNBased InnoSwitch3 IC

Power Integrations Delivers OneMillionth GaNBased InnoSwitch3 IC

Partners with Anker Innovations to drive GaN revolution in mass-market AC-DC power adapters SAN JOSE, Calif.-- Power Integrations, the leader in…

new products Oct 09, 2019 by Power Integrations
Automotive Compliant Linear Regulators from Diodes Incorporated Deliver High PSRR and Low Quiescent Current

Automotive Compliant Linear Regulators from Diodes Incorporated Deliver High PSRR and Low Quiescent Current

This article highlights  Diodes Inc. AP7315Q and AP7343Q LDO linear regulators compliant to AEC-Q100 Grade 1 that deliver 150mA and 300mA…

new products Oct 09, 2019 by Diodes Incorporated
Bosch Enters Automotive Silicon Carbide Race

Bosch Enters Automotive Silicon Carbide Race

News Oct 08, 2019 by Paul Shepard
Eval Board for New 4-Pin SiC MOSFETs with Up To 35% Lower Switching Losses

Eval Board for New 4-Pin SiC MOSFETs with Up To 35% Lower Switching Losses

News Oct 08, 2019 by Paul Shepard
Ultra-High-Efficiency 4A Two-Input Power Mux for IoT Applications

Ultra-High-Efficiency 4A Two-Input Power Mux for IoT Applications

new products Oct 08, 2019 by Paul Shepard
Double Pulse Test Software Simplifies Wide Bandgap Power Device Testing

Double Pulse Test Software Simplifies Wide Bandgap Power Device Testing

new products Oct 08, 2019 by Paul Shepard
Tektronix Simplifies Power Efficiency Testing with New Double Pulse Test Software for AFG31000

Tektronix Simplifies Power Efficiency Testing with New Double Pulse Test Software for AFG31000

Tektronix, Inc. today announced the availability of a new software plugin for its AFG31000 Arbitrary/Function Generator that makes it possible to…

new products Oct 08, 2019 by Tektronix