This article discusses the advantages of chip-scale packaging of GaN transistors by evaluating its thermal performance…
This article discusses the advantages of chip-scale packaging of GaN transistors by evaluating its thermal performance and efficiency.
Over the years, GaN power has been sarcastically described as “the technology of the future…and always will be.”…
Over the years, GaN power has been sarcastically described as “the technology of the future…and always will be.” While silicon carbide devices
This article discusses a new approach for prototyping using Imperix's BoomBox RCP platform and its application as well as…
This article discusses a new approach for prototyping using Imperix's BoomBox RCP platform and its application as well as its integration to…
This article highlights the importance of modelling and simulation task in design methodology to reduce the number of…
This article highlights the importance of modelling and simulation task in design methodology to reduce the number of design iterations and acquire…
Texas Instruments introduced the industry’s first 40-A, 16-VIN synchronous step-down DC/DC converter with true…
Texas Instruments introduced the industry’s first 40-A, 16-VIN synchronous step-down DC/DC converter with true differential remote-voltage sensing
This article presents the characteristics and performances of a new range of high voltage ceramic capacitors manufactured…
This article presents the characteristics and performances of a new range of high voltage ceramic capacitors manufactured using a new ceramic…
This article discusses the main features which make the IGCT an attractive option for high power applications with…
This article discusses the main features which make the IGCT an attractive option for high power applications with respect to the technology…
This article highlights Gallium Nitride's (GAN) advantages over silicon in terms of performance to finally displace…
This article highlights Gallium Nitride's (GAN) advantages over silicon in terms of performance to finally displace silicon in power devices.
This article introduces IC integration to allow PCB based sensor solutions for the reduction of cost and footprint of…
This article introduces IC integration to allow PCB based sensor solutions for the reduction of cost and footprint of power converters.
Artesyn Embedded Technologies today released a new 1600-watt power supply, the HS-OCS Series, designed for hyperscale data centers
Artesyn Embedded Technologies today released a new 1600-watt power supply, the HS-OCS Series, designed for hyperscale data centers
This article discusses methods on solving challenges in power electronics and suggests methods to improve performance of…
This article discusses methods on solving challenges in power electronics and suggests methods to improve performance of power electronics…