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1.5A & 3A Buck LED Drivers Target ISO26262 Automotive and Industrial Applications

1.5A & 3A Buck LED Drivers Target ISO26262 Automotive and Industrial Applications

Designing Safe and Fast DC Charging Stations with Optocouplers

Designing Safe and Fast DC Charging Stations with Optocouplers

Rapid growth of electric vehicle (EV) fleet drives strong demand for charging infrastructure to extend EVs’ travel range. DC fast charging…


2.55mm-Profile IDCs for Space-Constrained Applications in Harsh Environments

2.55mm-Profile IDCs for Space-Constrained Applications in Harsh Environments

93% Efficient Long-Life 120W and 240W DIN Rail Power Supplies

93% Efficient Long-Life 120W and 240W DIN Rail Power Supplies

How Long will Your System Last A Discrete IGBT Reliability Study

How Long will Your System Last A Discrete IGBT Reliability Study

High quality and reliability are among the key aspects in the design of a power semiconductor. The influence of these parameters is evident since they


Thick-Film Chip Resistors Deliver Industry-Leading TCR Characteristics

Thick-Film Chip Resistors Deliver Industry-Leading TCR Characteristics

Smallest & Lowest-Power Cellular SiP Targets NB-IoT Applications

Smallest & Lowest-Power Cellular SiP Targets NB-IoT Applications

2-Coil Fan Drivers now in SOT25 Straight Lead Package to Support Automated Production

2-Coil Fan Drivers now in SOT25 Straight Lead Package to Support Automated Production

TDK Showcases Automotive, AR/VR, IoT, Mobile and Wearables at CES 2019

TDK Showcases Automotive, AR/VR, IoT, Mobile and Wearables at CES 2019


News Dec 11, 2018 by Paul Shepard
ROHM to Highlight Automotive, Industrial and Consumer Solutions at CES 2019

ROHM to Highlight Automotive, Industrial and Consumer Solutions at CES 2019


News Dec 11, 2018 by Paul Shepard
16th Battery Experts Forum with Enormous Growth

16th Battery Experts Forum with Enormous Growth

This article highlights Battery Experts Forum conference on battery technology and celebrates its premiere in 2019 at the Forum Messe Frankfurt.


World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package

World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package


News Dec 10, 2018 by Paul Shepard
High Reliability 300mm Pitch Power Connectors and Cable Assemblies with 10A Current Capacity

High Reliability 300mm Pitch Power Connectors and Cable Assemblies with 10A Current Capacity

Introducing Harwin's Expansive M300 Family of robust cable-to-board, board-to-board, and cable-to-cable power connectors.


new products Dec 10, 2018 by Harwin
40-60W Cost-Effective AC-DC Power Supplies

40-60W Cost-Effective AC-DC Power Supplies

Smart Barakà: The First SensorTile Dev Kit Fine Jewelry

Smart Barakà: The First SensorTile Dev Kit Fine Jewelry


News Dec 06, 2018 by Paul Shepard
1MBd High-Speed Optocouplers Feature Schmitt-Trigger Functionality

1MBd High-Speed Optocouplers Feature Schmitt-Trigger Functionality

IEEE Energy Conversion Congress and Expo 2018

IEEE Energy Conversion Congress and Expo 2018

Energy Conversion Congress and Expo (ECCE)—the foremost IEEE conference in the field of electrical and electromechanical energy…


tech insights Dec 05, 2018 by Gary Dolny
MCUs Optimized for Even Smaller, More Capable, and Power-Efficient Smart Objects

MCUs Optimized for Even Smaller, More Capable, and Power-Efficient Smart Objects

Rugged Micropower Magnetic Sensor ICs Maximize Battery Life

Rugged Micropower Magnetic Sensor ICs Maximize Battery Life

High-Performance USB 3.1 Type C Connectors for Industry

High-Performance USB 3.1 Type C Connectors for Industry