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pSemi Plans for 5G and IoT Growth with New Design Center

pSemi Plans for 5G and IoT Growth with New Design Center

pSemi Corporation, a subsidiary of Japanese electronics giant Murata, is opening a new semiconductor design center in India — eyeing growth in…


News Apr 18, 2021 by Shannon Cuthrell
Renesas’ Motor Control ICs Simplify Brushless DC  Motor Control Design

Renesas’ Motor Control ICs Simplify Brushless DC Motor Control Design

The new ICs are systems in a chip (SIPs) delivering improved motor control while saving board space and improving power efficiency by 35%


High-Density, Quarter Brick Dc-Dc Converters for Railway Applications

High-Density, Quarter Brick Dc-Dc Converters for Railway Applications

This article highlights CUI Inc. 75 and 100 watt high-density, quarter brick dc-dc series to its isolated dc-dc converter line.


Project LEVIS Aims to Develop Lightweight EV Components

Project LEVIS Aims to Develop Lightweight EV Components

Project LEVIS, with 13 partner groups, officially launched last month.


CPS Technologies AlSiC Components to be Used in MethaneSAT Satellite Program

CPS Technologies AlSiC Components to be Used in MethaneSAT Satellite Program

CPS provides the MethaneSAT satellite program with aluminum and silicon carbide-based components with advanced thermal properties.


News Apr 06, 2021 by Stephanie Leonida
TDK and Ultra Librarian Partner on Multi-power Module Reference Design L

TDK and Ultra Librarian Partner on Multi-power Module Reference Design L

Ultra Librarian and TDK collaborate to provide design engineers with access to a reference design that can help speed up the design process


News Apr 05, 2021 by Stephanie Leonida
Automatic Magnetic Simulation Generation for Inductive Components Design

Automatic Magnetic Simulation Generation for Inductive Components Design

This article highlights PERMO GaN and SiC technologies which permit to obtain the most efficient converters in the smallest size.


KULR and Andretti to Partner on Thermal Management Testing and Design Platform

KULR and Andretti to Partner on Thermal Management Testing and Design Platform

KULR and Andretti Autosport announced a long-term partnership to bring the same technology used in the Mars Rover to electric vehicle batteries and…


News Apr 02, 2021 by Shannon Cuthrell
Vicor’s Underwater Remote Operating Vehicles Rely On Modular Design

Vicor’s Underwater Remote Operating Vehicles Rely On Modular Design

The flexible design approach of the Video Ray series of Remote Operating Vehicles (ROV) enable quick configuration for custom missions


NXP Manufacturing Facilities in Texas Re-open for Business Following Storm-Induced Shutdown

NXP Manufacturing Facilities in Texas Re-open for Business Following Storm-Induced Shutdown

NXP Semiconductors provides an update on two recently closed manufacturing facilities in Austin, Texas.


News Mar 28, 2021 by Stephanie Leonida
Power Companies Tackle Climate and World Stewardship

Power Companies Tackle Climate and World Stewardship

STMicroelectronics, TDK Corporation, and PREMO are a few companies leading the way in defining sustainable business practices for the power…


News Mar 26, 2021 by Stephanie Leonida
Magnetic Core Characteristics and Applications

Magnetic Core Characteristics and Applications

TDK offers compact, current-compensated ring core chokes

TDK offers compact, current-compensated ring core chokes

This article highlights series of current-compensated EPCOS double-ring core chokes for the suppression of common-mode interferences.


Internal Design of Current Transformers

Internal Design of Current Transformers

This article offers an overview of the basic working principles and design of current transformers.


Transphorm Tailors Power Devices to Crypto Mining Applications

Transphorm Tailors Power Devices to Crypto Mining Applications

Gallium nitride (GaN) power conversion products manufacturer Transphorm has recently announced that its device portfolio is compatible with…


Bourns Announces 1210-Size Automotive Grade Common Mode Chip Inductors

Bourns Announces 1210-Size Automotive Grade Common Mode Chip Inductors

Model PAC18R series features a shaft sealing for an enhanced ingress protection level and a precise rotational feel.


SEMI-THERM Conference to Be Held Virtually March 22–26

SEMI-THERM Conference to Be Held Virtually March 22–26

The 37th annual SEMI-THERM conference and exhibition will take place virtually March 22–26. Here’s a preview of the event.


News Mar 21, 2021 by Shannon Cuthrell
Bourns Introduces New AEC-Q200 Compliant High Current Shielded Power Inductor Series

Bourns Introduces New AEC-Q200 Compliant High Current Shielded Power Inductor Series

This new series features high rated current, low radiation, low DC resistance, low buzz noise and a wide operating temperature range


GaN Systems and Silanna Semiconductor Release ACF Charger Reference Design

GaN Systems and Silanna Semiconductor Release ACF Charger Reference Design

The new design is for a highly efficient, 65 watt active clamp flyback charger targeted at USB-C power delivery (PD) applications


The Basics of Magnetic Materials

The Basics of Magnetic Materials

This article highlights the basics of magnetic materials — the control, transfer, and conditioning of electric power.