Würth Elektronik eiSos is increasing its presence on the Spanish market with the opening of the new Design & Application…
Würth Elektronik eiSos is increasing its presence on the Spanish market with the opening of the new Design & Application Centre in Barcelona
Alpha Assembly Solutions the world leader in the production of electronic soldering materials opened its new European…
Alpha Assembly Solutions the world leader in the production of electronic soldering materials opened its new European Headquarters in Woking,…
CEA-Leti announced it has signed an agreement with Keysight Technologies to adapt Leti’s UTSOI extraction flow methodology
CEA-Leti announced it has signed an agreement with Keysight Technologies to adapt Leti’s UTSOI extraction flow methodology
Integrated Device Technology, Inc.® completed the acquisition of privately held ZMDI (Zentrum Mikroelektronik Dresden…
Integrated Device Technology, Inc.® completed the acquisition of privately held ZMDI (Zentrum Mikroelektronik Dresden AG) for $307 million.
FTCAP has entered into a global sales partnership with the US company Richardson Electronics, Ltd.
FTCAP has entered into a global sales partnership with the US company Richardson Electronics, Ltd.
This article highlights Dean Technology, Inc. HVA series axial lead high voltage diode line designed specifically to…
This article highlights Dean Technology, Inc. HVA series axial lead high voltage diode line designed specifically to withstand high operating…
Torex Semiconductor Ltd. has launched the XC6230 series of 2A high-speed multifunction LDO regulators with adjustable output.
Torex Semiconductor Ltd. has launched the XC6230 series of 2A high-speed multifunction LDO regulators with adjustable output.
Design engineers looking for capacitors to have a more defined change of capacitance with applied voltage can now specify…
Design engineers looking for capacitors to have a more defined change of capacitance with applied voltage can now specify the VC1 range from…
Henkel Adhesive Technologies continues to expand its thermal materials portfolio and today announced the development and…
Henkel Adhesive Technologies continues to expand its thermal materials portfolio and today announced the development and commercialization of GAP…
Mitsubishi Electric Corporation announced the J1-Series high-power semiconductor modules featuring compact 6-in-1…
Mitsubishi Electric Corporation announced the J1-Series high-power semiconductor modules featuring compact 6-in-1 packages mainly for use in…
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