Advanced Analogic Technologies Incorporated (AnalogicTech) and Vanguard International Semiconductor Corporation (VIS) today announced plans to integrate AnalogicTech's 0.35-micron multi-voltage mixed-signal ModularBCD process technology into VIS' advanced 200-mm submicron fabrication facilities in Taiwan.
The deployment of AnalogicTech's ModularBCD process technology is part of the VIS strategy to extend its process spectrum of BCD (Bipolar-CMOS-DMOS) technology, and enhances the position of VIS in the specialty foundry industry. For AnalogicTech, manufacturing ModularBCD wafers in world-class VIS facilities furthers its corporate strategy to re-use DRAM fabs for the production of new-generation power management ICs, products benefiting from process technology especially developed by AnalogicTech for such advanced equipment sets. According to the agreement, VIS will manufacture wafers for AnalogicTech and also offer the process for foundry to other fabless companies and IDMs for products that do not compete directly with AnalogicTech's power management offerings.
"AnalogicTech's customers are developing handsets and consumer electronics that demand the highest quality standards -- even more strict than many high-density DRAM devices," said Allen Lam, Vice President of Worldwide Operations for AnalogicTech. "As a leading specialty IC foundry service provider, VIS has a proven track record of high quality, high volume foundry services that will enable us to meet or exceed customer expectations with our new ModularBCD products."
"VIS is committed to becoming the world leader in specialty and customized IC manufacturing foundry services," said Steve Pletcher, Managing Director at VIS Micro (VIS' marketing arm in North America). "Collaborating with the power and analog technology experts at AnalogicTech strengthens VIS' portfolio of specialty processes and helps us meet diverse customer demands. Complementing our extensive analog CMOS, high-voltage, mixed-signal, and conventional BCD foundry offering, the high-integration, electrical isolation, and multi-voltage capability of ModularBCD is ideal for today's complex ICs and system-on-chip integration. Such capability translates into high performance and reduced technical risk for our customers."
"We are excited to see ModularBCD deployed in VIS' advanced manufacturing facilities," commented Richard K. Williams, President, CEO, and CTO for AnalogicTech. "As part of a carefully managed and highly-selective long-term multi-source supply and license strategy, our agreement with VIS offers further support that by manufacturing in high-volume ex-DRAM facilities, ModularBCD wafer capacity should be able to keep pace with global demand, both for AnalogicTech and VIS' other foundry customers."
