Vincotech Adds Baseplate-less, Medium-Power flow S3 Package

April 08, 2020 by Paul Shepard

The novel baseplate-less housing flow S3 package from Vincotech comprises 67% more ceramic area than the company’s flow 1 configuration. Together with the low thermal resistance, flow S3 enables higher power density and more compact designs. Low inductivity is ensured by low profile 12mm package, free pin positioning and the possibility to integrate ceramic capacitors.

flow S3 housing includes pre-applied phase-change material and was designed to offer excellent thermal contact and low thermal resistance to the heat sink. And the elimination of a copper baseplate reduces costs.

Summary of flow S3 Features:

  • Compact, baseplate-less format
  • CTI600 housing material
  • 12 mm low-inductive housing
  • Variable pin position for very low inductivity
  • Fast, easy assembly
  • Press-fit pins with stress-relief zone
  • Pre-applied phase-change material