Tessera Technologies (San Jose, CA) and Texas Instruments Inc. (TI, Dallas, TX) have settled pending litigation related to chip-scale packaging technology, according to the companies. Tessera reported that the deal results in the dismissal of all patent infringement claims and related issues in the US District Courts in Oakland, CA, and Marshall, TX. Tessera filed a complaint against TI in June alleging the company was using its IP without permission in its DSP designs.
Under terms of the settlement, both companies have agreed to release the other from all pending claims and counterclaims. TI has agreed to make a one-time payment to Tessera. The settlement also includes a royalty-bearing license that covers TI’s MicroStar family of FBGA packages. The MicroStar package is used for TI’s DSP technology, which is used in cellular phones, MP3 players and PDAs. Other terms were not disclosed.
"We look forward to building a positive business relationship with TI as we move forward," said Chris Pickett, senior VP, licensing business and general counsel, Tessera.
