Smaller Automotive Power Package for the Connected Car

NXP Semiconductors announced the availability of its new line of automotive power MOSFETs housed in a compact, thermally enhanced Loss Free PAcKage (LFPAK). The LFPAK33 is optimized for high-density automotive applications with a footprint more than 80 percent smaller than the most popular solution in use today. The significantly smaller low-resistance package was created in response to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability.

"As more subsystems are crammed into the connected vehicle, the need for rugged, compact power systems are becoming ever greater," said Richard Ogden, product marketing manager, at NXP. "The introduction of the LFPAK33 sets the benchmark for automotive MOSFET performance in a compact package. This extension of the LFPAK portfolio provides designers with more product choices than anything on the market today."

The NXP LFPAK33 package uses a copper clip design to reduce the package resistance and inductance which in turn reduces the RDS(on) and switching losses of the MOSFET. The full NXP range of LFPAKs allows designers the broadest range of devices in this compact footprint.

Benefits include: Ultra-compact footprint of 10.9 mm2; Thermal Performance, no wires, no glue, 175 degrees C T­j max; Low package resistance and inductance, up to 70A max rating; Extensive portfolio with product range between 30V to 100V, as low as 6.3mΩ.

Target applications include: Next generation engine management; Chassis and safety; LED Lighting; Relay replacement; C2X systems; Radar; Infotainment systems; Navigation systems; and ADAS. The new LFPAK33 compact automotive power package is available now.