OKI Enhances Range of Thermal Characteristics Analysis Services for Semiconductor Devices
OKI Engineering announced that it has expanded its range of thermal characteristics analysis services for semiconductor devices. A service that measures the thermal resistance and heat capacity of power devices and optical devices will be available from today.
Recently, heat generated in electronic equipments can possibly have a big influence on the malfunction and the breakdown of electronic equipments etc. by the high integration and the density growth of semiconductor devices. Therefore, it is very important to accurately grasp the thermal characteristics of a new semiconductor device at the design stage. Generally, TEG is used to measure its thermal resistance at the design stage, However, TEG method can only measure thermal resistance of an entire semiconductor device and thermal resistance values often deviate between the semiconductor device itself and the device that is assembled in an equipment. Additionally, preparing TEG is time-consuming.
"Based on our expertise and experience in reliability test and analysis, we have been providing services that precisely and rapidly evaluate the thermal characteristics of relatively small power semiconductor devices since December 2009," said Yutaka Asai, President of OKI Engineering. "Now, with our expanded thermal characteristics analysis services, we have enhanced the scope and are targeting power devices and optical devices that require large amount of electric power. Deploying a unique measurement method, these services evaluate and analyze thermal characteristics per composite materials of semiconductor devices. This approach eliminates the need of a TEG and allows rapid measurements and flexible response to changes of materials."
The service presents thermal characteristics data visually as graphs, making thermal characteristics easy to understand. The company will also be able to assess the heat dissipation effects of assembly boards with composite materials, heat-radiation materials, and heat-sinks.