INCEP Technologies (San Diego, CA) announces the addition of Dr. Carl Hoge as senior IC packaging architect. Dr. Hoge brings over 21 years of experience in the semiconductor industry in a wide variety of areas including semiconductor interconnect, IC package materials and development, wafer processing, and reliability analysis. Dr. Hoge will be INCEP's lead technologist in chip packaging, focused on bringing a new high-performance microprocessor chip package technology to market.
Dr. Hoge holds a Doctorate of Engineering, Material Science from the University of California (UC), Berkeley, a Master of Business Administration from UCLA, a Master of Science, Material Science from UC, Berkeley, and a Bachelor of Science, Material Science from UC, Berkeley.
"With the addition of a person with Carl's background we have reached critical mass", said Jim Hjerpe Kaskade, president of INCEP, "We're very excited to have Carl lead our chip packaging developments in power interconnect targeted for our leading customers such as Intel Corporation."