Fujitsu to Construct $1.5 Billion Fab in Japan

March 18, 2004 by Jeff Shepard

Fujitsu Ltd. (Japan) reported that it is planning a $1.5 billion facility in central Japan to mass-produce logic chips on 90 nm and 65 nm volume processes, employing large-diameter 300 mm wafers. The new facility at its Mie semiconductor plant is scheduled to become operational in April 2005, with volume shipments starting the following September. Maximum production capacity is expected to reach 13,000 wafers per month.

Fujitsu will initially invest about $703 million for the first phase of construction through fiscal 2005, with phase two and subsequent investment to be made in stages and in careful consideration of market demand. Along with high-volume capability, Fujitsu's facility at Mie will also be equipped to handle small-volume, multi-product, batch production.