Dynex Power Inc. today announced that its subsidiary, Dynex Semiconductor Ltd, had been awarded grants totaling €1 million by the European Union's Horizon 2020 Research and Innovation Programme to develop the next generation of electronic components for use in aircraft. The grant will fund Dynex's costs as a partner in a three year, €7 million project being coordinated by Siemens AG. The project, known as the Integrated, Intelligent Modular Power Electronic Converter Project (or I2MPECT for short) is being carried out by a pan European consortium of nine organizations and is designed to provide significant advances in the state of the art in power converters for aircraft applications thus improving the competiveness of European aviation through cost efficiency and innovation.
Dynex's contribution to the project will be to deliver innovative 3D power semiconductor device packaging based on planar interconnect technologies with double-sided integrated cooling for wide band-gap wire-bond free power semiconductor devices.
Dr Steve Jones, IGBT Module Technology Manager and Dynex Project Leader for the I2MPECT Project commented "We are delighted by this award. Dynex has significant technological strengths in IGBT and power module packaging and we see this project as an exciting opportunity to extend our technology into the aviation sector". Dr Jones continued, "This grant follows on from our success last year in winning a grant from the Technology Strategy Board, the UK's innovation agency, to work in a consortium with Cummins to develop IGBT power module packages for automotive applications.†This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No 636170.
