Advanced Power Electronics Announces New GreenFET Packages Using DirectFET Packaging Technology
Advanced Power Electronics Corp. (APEC) confirmed that it has products in qualification in the new GreenFET™ packages using the DirectFET™ advanced power management packaging technology licensed from International Rectifier (IR).
Designed for use in ac-dc and dc-dc power conversion applications in computers, notebooks, telecommunications and consumer electronics devices, Advanced Power claims that these surface-mount power packages offer extremely efficient cooling for Power MOSFET chips in an SO-8 footprint or smaller. Unlike standard plastic discrete packages, the GreenFET metal can construction enables dual-sided cooling to significantly increase the current handling capacity in high frequency dc-dc buck converters.
Since obtaining the license from IR, Advanced Power has been packaging and testing its latest generation of MOSFET chip technology in both small and medium size GreenFET power packages to ensure compatibility and long-term reliability. The company expects to sample the first products in both size GreenFET packages within the next 60 to 90 days. These will be physically identical in terms of pad layout and board footprint to the corresponding SQ, ST, MP and MX DirectFET packages.
VP of IR’s Enterprise Power business unit, Tim Phillips said, "IR’s DirectFET package technology is increasingly the preferred solution to reduce energy losses while shrinking the design footprint in advanced computing, consumer and communications applications. This license agreement with APEC, along with one other previously announced agreement, serves to secure supply worldwide for the customer demand of this industry leading package." He added "We are continually developing leading-edge technology to save energy and, through licensing agreements, we can broaden the energy-saving impact made possible with innovations such as DirectFET, further expanding our presence in the largest segment of the power management market."
"Advanced Power Electronics Corp. has dramatically expanded its advanced power MOSFET product range with our GreenFET packages, while building on our long term relationship with IR," stated Eric Kwat, President of Advanced Power Electronics Corp. "By combining our latest MOSFET chip technology with this important package option, we now offer our customers broader choices to achieve both energy and cost-efficient solutions for their applications, whilst minimizing any environmental impact thanks to a RoHS-compliant, halogen-free "green" package. Our latest MOSFET devices have extremely low figure of merit combining excellent on-resistance with fast switching performance, and coupled with the GreenFET’s double-sided cooling capability, they will enhance our position as one of the leading suppliers of MOSFET products."
