Vicor Intros V-I Chip and FPA Architecture

Vicor Corp. (Andover, MA) introduced a new power system architecture based on an array of proprietary power conversion technologies. The new Factorized Power Architecture (FPA) provides performance at a lower cost than attained with conventional distributed power architecture, including intermediate bus architecture. FPA and its enabling V-I Chips (VICs) will supersede the paradigm based on high-density, dc/dc converter bricks and non-isolated, point-of-load converters.

FPA is enabled by power conversion components, VICs, which process up to 200W of power in a small (less than 0.25in³) and light (less than 13g) power ball grid array package, with a power density up to 800W/in³, five times better than any competitive product. The functional building blocks will be deployed as surface-mount components to create a flexible factorized power system.

The first VIC product offering will be introduced in May 2003. Additional FPA power products will be introduced over the next several months. VICs for FPA systems will be priced as low as $0.12/W or $0.31/A. A 200W PRM or an 80A VTM will be priced at $25 each in OEM quantities. VIC will be shipped in JEDEC trays or taped and reeled for use with automated pick-and-place equipment.