TO220 FullPAK Wide Creepage Package
Infineon Technologies AG introduced the TO-220 FullPAK Wide Creepage package
Infineon Technologies AG introduced the TO-220 FullPAK Wide Creepage package. The package is offered for the 600 V CoolMOS™ CE, targeting a broad range of low power consumer applications. This package features an improved creepage and has been developed to meet the demanding requirements of open frame power supplies where pollution might lead to arcing failures of applications.
The TO-220 FullPAK Wide Creepage replaces frequently used workarounds to increase creepage distance such as silicon potting, the usage of sleeves, pre-bending of leads or others. Offering a better alternative to workarounds, customers profit from reduced system costs when implementing the new package.
Wide spread pins prevent failures
The TO-220 FullPAK Wide Creepage package targets open frame power supplies such as TV adapters where dust can enter the case through air vents. These dust particles can reduce the effective creepage between pins over time which may lead to high voltage arcing. The new TO-220 FullPAK Wide Creepage package comes with a pin distance of 4.25 mm instead of the prevailing 2.54 mm found in a standard TO-220 FullPAK package.
About Infineon
Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future. In the 2019 fiscal year (ending 30 September), the Company reported sales of €8.0 billion with about 41,400 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange and in the USA on the over-the-counter market OTCQX International Premier.
