Thermacore International (Lancaster, PA) expanded its line of power semiconductor cooling solutions to include the new Therma-Fin folded-fin heat-sinks, which have been demonstrated to dissipate heat loads of up to 2kW.
Therma-Fin utilizes Thermacore’s new folded-fin technology to maximize surface area, thus increasing the flow of heat from the component into the air. Aluminum or copper fins can be epoxied to the cooling plate or soldered/brazed to increase reliability and minimize thermal resistance.
Base options include Therma-Base vapor chambers, copper bases, aluminum bases, and copper or aluminum bases with embedded heat pipes. Therma-Base and embedded heat pipe base options minimize spreading resistance at the heat source, optimizing the performance of the heatsink. Heat loads from several watts to kilowatts can be accommodated using this technology.
Therma-Fin’s thermal performance allows fans in the system to run at a lower speed for quieter operation and increased reliability. Multiple mounting options are available to facilitate attachment to components.
